A comparative study of air and nitrogen thermal plasmas for PFCs decomposition

Chemical Engineering Journal

Volumn 185-186, Issue , 2012, Pages 193-200

  Choi, Sooseok ^a,b   Hong, Sang Hee ^a   Lee, Hyun Seok ^a,c   Watanabe, Takayuki ^b  

^a Seoul National University   (South Korea)

^b TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^c LG Chemical Ltd   (South Korea)

Author keywords

Byproduct; Destruction and removal efficiency (DRE); Electrical conductivity; Perfluorocompounds (PFCs); Plasma forming gas; Thermal plasma

Indexed keywords

AIR PLASMAS; COMPARATIVE STUDIES; DECOMPOSITION PROCESS; DESTRUCTION AND REMOVAL EFFICIENCY; ELECTRICAL CONDUCTIVITY; FORMING GAS; HIGHER TEMPERATURES; HOLLOW ELECTRODES; INPUT POWER; PERFLUOROCOMPOUNDS; REACTANT GAS; RESIDENCE TIME; SEMICONDUCTOR MANUFACTURING PROCESS; THERMAL PLASMA; WASTE GAS;

BYPRODUCTS; ELECTRIC CONDUCTIVITY; ENERGY CONVERSION; FLOW RATE; GREENHOUSE GASES; HYDROGEN; NITROGEN PLASMA; NUMERICAL ANALYSIS; PLASMA DIAGNOSTICS; SEMICONDUCTOR DEVICE MANUFACTURE;

NITROGEN;

EID: 84862825492     PISSN: 13858947     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cej.2012.01.077     Document Type: Article

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