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Volumn 16, Issue 3, 2003, Pages 429-435
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Optimization of gas utilization in plasma processes
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Author keywords
Chemical vapor deposition; Environmental factors; Etching; Plasma diagnostics
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Indexed keywords
CHEMICAL REACTIONS;
CHEMICAL VAPOR DEPOSITION;
CLEANING;
ENVIRONMENTAL PROTECTION;
ETCHING;
FLUORINE COMPOUNDS;
GAS EMISSIONS;
NITRIDES;
OPTIMIZATION;
PLASMA APPLICATIONS;
PLASMA DIAGNOSTICS;
SULFUR COMPOUNDS;
ENVIRONMENTAL FACTORS;
NITRIDE ETCHING;
PERFLUORO COMPOUNDS;
PLASMA EFFICIENCY;
TAGUCHI METHOD;
SEMICONDUCTOR DEVICE MANUFACTURE;
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EID: 0041384592
PISSN: 08946507
EISSN: None
Source Type: Journal
DOI: 10.1109/TSM.2003.815635 Document Type: Article |
Times cited : (14)
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References (10)
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