Phonon dominated heat conduction normal to Mo/Si multilayers with period below 10 nm

Nano Letters

Volumn 12, Issue 6, 2012, Pages 3121-3126

  Li, Zijian ^a   Tan, Si ^a   Bozorg Grayeli, Elah ^a   Kodama, Takashi ^a   Asheghi, Mehdi ^a   Delgado, Gil ^b   Panzer, Matthew ^b   Pokrovsky, Alexander ^b   Wack, Daniel ^b   Goodson, Kenneth E ^a  

^a Stanford University   (United States)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

metal dielectric interface; Mo Si multilayers; Nanoscale heat conduction; phonon scattering; thermal interface resistance

Indexed keywords

EFFECTIVE CONDUCTIVITY; ELECTRON PHONON SCATTERING; FREE PATH; INTERFACE SCATTERING; LENGTH SCALE; METAL FILM; METAL-DIELECTRIC INTERFACE; MO/SI MULTILAYER; NANO SCALE; NEW MODEL; NON EQUILIBRIUM; PERIODIC MULTILAYERS; PHONON TRANSPORT; PHONON-ELECTRON; QUASI-BALLISTIC; THERMAL CONDUCTION; THERMAL INTERFACES;

ENERGY CONVERSION; HEAT CONDUCTION; INTERFACES (MATERIALS); METALLIC FILMS; PHONON SCATTERING; PHONONS;

MULTILAYERS;

MOLYBDENUM; NANOMATERIAL; SILICON;

ARTICLE; CHEMICAL MODEL; CHEMISTRY; COMPUTER SIMULATION; HEAT; PARTICLE SIZE; THERMAL CONDUCTIVITY; ULTRASTRUCTURE;

COMPUTER SIMULATION; HOT TEMPERATURE; MODELS, CHEMICAL; MOLYBDENUM; NANOSTRUCTURES; PARTICLE SIZE; SILICON; THERMAL CONDUCTIVITY;

EID: 84862282171     PISSN: 15306984     EISSN: 15306992     Source Type: Journal    
DOI: 10.1021/nl300996r     Document Type: Article

References (43)

1. Costescu, R. M.; Cahill, D. G.; Fabreguette, F. H.; Sechrist, Z. A.; George, S. M. Science 2004, 303 (5660) 989-990
2. Ju, Y. S.; Hung, M. T.; Carey, M. J.; Cyrille, M. C.; Childress, J. R. Appl. Phys. Lett. 2005, 86 (20) 203113
3. Swartz, E.; Pohl, R. Rev. Mod. Phys. 1989, 61 (3) 605-668
4. Majumdar, A.; Reddy, P. Appl. Phys. Lett. 2004, 84 (23) 4768
5. Hopkins, P. E.; Norris, P. M. J. Heat Transfer 2009, 131 (4) 043208
6. Chien, H.-C.; Yao, D.-J.; Hsu, C.-T. Appl. Phys. Lett. 2008, 93 (23) 231910
7. Liang, X. G.; Shi, B. Mater. Sci. Eng., A 2000, 292 (2) 198-202
8. Stearns, D. G.; Rosen, R. S.; Vernon, S. P. Appl. Opt. 1993, 32 (34) 6952-6960
9. Nedelcu, I.; van de Kruijs, R. W. E.; Yakshin, A. E.; Bijkerk, F. J. Appl. Phys. 2008, 103 (8) 083549
10. Kola, R. R.; Windt, D. L.; Waskiewicz, W. K.; Weir, B. E.; Hull, R.; Celler, G. K.; Volkert, C. A. Appl. Phys. Lett. 1992, 60 (25) 3120-3122
11. Kaganov, M. I.; Lifshitz, I. M.; Tanatarov, L. V. Sov. Phys. JETP 1957, 4 (2) 173-178
12. Qiu, T. Q.; Tien, C. L. Int. J. Heat Mass Transfer 1994, 37 (17) 2789-2797
13. Hopkins, P. E.; Norris, P. M. Appl. Surf. Sci. 2007, 253 (15) 6289-6294
14. Qiu, T. Q.; Juhasz, T.; Suarez, C.; Bron, W. E.; Tien, C. L. Int. J. Heat Mass Transfer 1994, 37 (17) 2799-2808
15. Lin, Z.; Zhigilei, L. V.; Celli, V. Phys. Rev. B 2008, 77, 7
16. Freitag, J. M.; Clemens, B. M. Appl. Phys. Lett. 1998, 73 (1) 43-45
17. Rosen, R. S.; Stearns, D. G.; Viliardos, M. A.; Kassner, M. E.; Vernon, S. P.; Cheng, Y. D. Appl. Opt. 1993, 32 (34) 6975-6980
18. Cahill, D. G. Rev. Sci. Instrum. 1990, 61 (2) 802-808
19. Lee, J.; Li, Z.; Reifenberg, J. P.; Lee, S.; Sinclair, R.; Asheghi, M.; Goodson, K. E. J. Appl. Phys. 2011, 109 (8) 084902
20. Kim, J. H.; Feldman, A.; Novotny, D. J. Appl. Phys. 1999, 86 (7) 3959-3963
21. Cahill, D. G.; Lee, S. M.; Selinder, T. I. J. Appl. Phys. 1998, 83 (11) 5783-5786
22. Behkam, B.; Yang, Y.; Asheghi, M. Int. J. Heat Mass Transfer 2005, 48 (10) 2023-2031
23. De Bellis, L.; Phelan, P. E.; Prasher, R. S. J. Thermophys. Heat Transfer 2000, 14 (2) 144-150
24. Hopkins, P. E.; Kassebaum, J. L.; Norris, P. M. J. Appl. Phys. 2009, 105 (2) 023710
25. Chen, J. K.; Latham, W. P.; Beraun, J. E. J. Laser Appl. 2005, 17 (1) 63-68
26. Kittel, C. Introduction to solid state physics, 8th ed.; Wiley: Hoboken, NJ, 2005; p 680.
27. Bartkowiak, M.; Mahan, G. D. Semiconduct. Semimetals 2001, 70, 245-271
28. Allen, P. B. Phys. Rev. Lett. 1987, 59 (13) 1460-1463
29. Wang, X. Y.; Riffe, D. M.; Lee, Y. S.; Downer, M. C. Phys. Rev. B 1994, 50 (11) 8016-8019
30. Grimvall, G. The electron-phonon interaction in metals; North Holland Publishing Co.: Holland, The Netherlands, 1981; p 304.
31. Mcmillan, W. L. Phys. Rev. 1968, 167 (2) 331
32. Papaconstantopoulos, D. A.; Boyer, L. L.; Klein, B. M.; Williams, A. R.; Morruzzi, V. L.; Janak, J. F. Phys. Rev. B 1977, 15 (9) 4221-4226
33. Mcmillan, P. W. Glass Technol. 1983, 24 (4) 207-207
34. Savrasov, S. Y.; Savrasov, D. Y. Phys. Rev. B 1996, 54 (23) 16487-16501
35. Ju, Y. S.; Hung, M.-T.; Usui, T. J. Heat Transfer 2006, 128 (9) 919
36. Guo, L.; Hodson, S. L.; Fisher, T. S.; Xu, X. J. Heat Transfer 2012, 134 (4) 042402
37. Hopkins, P. E.; Norris, P. M. J. Heat Transfer 2009, 131 (2) 022402
38. Dames, C.; Chen, G. J. Appl. Phys. 2004, 95 (2) 682-693
39. Hopkins, P. E.; Duda, J. C.; Norris, P. M. J. Heat Transfer 2011, 133 (6) 062401
40. Sergeev, A. V. Phys. Rev. B 1998, 58 (16) 10199-10202
41. Sergeev, A. Phys. B (Amsterdam, Neth.) 1999, 263, 217-219
42. Colavita, E.; Franciosi, A.; Rosei, R.; Sacchetti, F.; Giuliano, E. S.; Ruggeri, R.; Lynch, D. W. Phys. Rev. B 1979, 20 (12) 4864-4871
43. Walker, J. D.; Khatri, H.; Ranjan, V.; Li, J.; Collins, R. W.; Marsillac, S. Appl. Phys. Lett. 2009, 94 (14) 141908