Nanoscale heat conduction across metal-dielectric interfaces

Journal of Heat Transfer

Volumn 128, Issue 9, 2006, Pages 919-925

  Ju, Y ^a,b   Hung, Ming Tsung ^a   Usui, Takane ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Biomedical Engineering Interdepartmental Program   (United States)

Author keywords

Josephson junctions; Nanolaminates; Nanoscale heat transfer; Thermal interface resistance

Indexed keywords

METAL-DIELECTRIC INTERFACES; NANOLAMINATES; THERMAL INTERFACE RESISTANCE;

CRYOGENICS; DIELECTRIC MATERIALS; ELECTRODES; ELECTRONS; HEAT RESISTANCE; INTERFACES (MATERIALS); LAMINATES; MATHEMATICAL MODELS; PHONONS; TEMPERATURE;

HEAT CONDUCTION;

CRYOGENICS; DIELECTRIC MATERIALS; ELECTRODES; ELECTRONS; HEAT CONDUCTION; HEAT RESISTANCE; INTERFACES (MATERIALS); LAMINATES; MATHEMATICAL MODELS; PHONONS; TEMPERATURE;

EID: 33750473712     PISSN: 00221481     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2241839     Document Type: Article

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