-
1
-
-
10844289008
-
Thermal fatigue testing of thin metal films
-
R. Mönig, R.R. Keller, and C.A. Volkert Thermal fatigue testing of thin metal films Rev Sci Instrum 75 11 2004 4997 5001
-
(2004)
Rev Sci Instrum
, vol.75
, Issue.11
, pp. 4997-5001
-
-
Mönig, R.1
Keller, R.R.2
Volkert, C.A.3
-
3
-
-
0025627148
-
Temperature-cycling acceleration factors for aluminiummetallization failure in VLSI applications
-
Dunn CF, McPherson JW. Temperature-cycling acceleration factors for aluminiummetallization failure in VLSI applications. In: 28th Annual proceedings reliability physics symposium; 1990. p. 252-8.
-
(1990)
28th Annual Proceedings Reliability Physics Symposium
, pp. 252-258
-
-
Dunn, C.F.1
McPherson, J.W.2
-
4
-
-
35548953054
-
Fatigue and thermal fatigue damage analysis of thin metal films
-
G.P. Zhang, C.A. Volkert, R. Schwaiger, R. Mönig, and O. Kraft Fatigue and thermal fatigue damage analysis of thin metal films Microelectron Reliab 47 2007 2007 2213
-
(2007)
Microelectron Reliab
, vol.47
, pp. 2007-2213
-
-
Zhang, G.P.1
Volkert, C.A.2
Schwaiger, R.3
Mönig, R.4
Kraft, O.5
-
5
-
-
33747087818
-
Length-scale-controlled fatigue mechanisms in thin copper films
-
G.P. Zhang, C.A. Volkert, R. Schwaiger, P. Wellner, E. Arzt, and O. Draft Length-scale-controlled fatigue mechanisms in thin copper films Acta Mater 54 2006 3127
-
(2006)
Acta Mater
, vol.54
, pp. 3127
-
-
Zhang, G.P.1
Volkert, C.A.2
Schwaiger, R.3
Wellner, P.4
Arzt, E.5
Draft, O.6
-
6
-
-
33750600346
-
Thermal stress of multilayered films on substrates and cantilever beams for micro-sensors and actuators
-
C.H. Hsueh, C.R. Luttrell, and T. Cui Thermal stress of multilayered films on substrates and cantilever beams for micro-sensors and actuators J Micromech Microeng 16 2006 2509 2515
-
(2006)
J Micromech Microeng
, vol.16
, pp. 2509-2515
-
-
Hsueh, C.H.1
Luttrell, C.R.2
Cui, T.3
-
7
-
-
0015203264
-
Surface reconstruction of aluminum metallization
-
Philofsky E, Ravi K, Hall K, Black J. Surface reconstruction of aluminum metallization. In: Potential wearout mechanism, 9th Annual IEEE proceedings of reliability physics; 1971. p. 120.
-
(1971)
Potential Wearout Mechanism, 9th Annual IEEE Proceedings of Reliability Physics
, pp. 120
-
-
Philofsky, E.1
Ravi, K.2
Hall, K.3
Black, J.4
-
8
-
-
0038784092
-
Interconnect failure due to cyclic loading
-
Keller RR, Mönig R, Volkert CA, Arzt E, Schwaiger R, Kraft O. Interconnect failure due to cyclic loading. In: AIP conference proceedings, (stress-induced phenomena in metallization 612); 2002. p. 119-32.
-
(2002)
AIP Conference Proceedings, (Stress-induced Phenomena in Metallization 612)
, pp. 119-132
-
-
Keller, R.R.1
Mönig, R.2
Volkert, C.A.3
Arzt, E.4
Schwaiger, R.5
Kraft, O.6
-
10
-
-
0028516231
-
Microstructural development during fatigue of copper foils 20-100 μm thick
-
M. Judelewicz, H.U. Künzi, N. Merk, and B. Ilschner Microstructural development during fatigue of copper foils 20-100 μm thick Mater Sci Eng A 186 1994 1 142
-
(1994)
Mater Sci Eng A
, vol.186
, pp. 1-142
-
-
Judelewicz, M.1
Künzi, H.U.2
Merk, N.3
Ilschner, B.4
-
11
-
-
0030231563
-
Low cycle fatigue of thin copper foils
-
S. Hong, and R. Weil Low cycle fatigue of thin copper foils Thin Solid Films 283 1996 175 181
-
(1996)
Thin Solid Films
, vol.283
, pp. 175-181
-
-
Hong, S.1
Weil, R.2
-
12
-
-
0035698838
-
Fatigue in thin films: Lifetime and damage formation
-
O. Kraft, R. Schwaiger, and P. Wellner Fatigue in thin films: lifetime and damage formation Mater Sci Eng A 319-321 2001 919 923
-
(2001)
Mater Sci Eng A
, vol.319-321
, pp. 919-923
-
-
Kraft, O.1
Schwaiger, R.2
Wellner, P.3
-
14
-
-
0024766321
-
Mechanical properties of thin films
-
W.D. Nix Mechanical properties of thin films Metall Trans A 20 1989 2217 2245
-
(1989)
Metall Trans A
, vol.20
, pp. 2217-2245
-
-
Nix, W.D.1
-
17
-
-
4043133247
-
Improved thermal stability of copper vias using a cyclical stress test
-
October 21-23
-
Alers GB, Kuo JJ, Harm G, Weinzierl SR, Ray GW. Improved thermal stability of copper vias using a cyclical stress test. In: UC berkeley extension advanced metallization conference (AMC); October 21-23, 2003.
-
(2003)
UC Berkeley Extension Advanced Metallization Conference (AMC)
-
-
Alers, G.B.1
Kuo, J.J.2
Harm, G.3
Weinzierl, S.R.4
Ray, G.W.5
-
19
-
-
19744377807
-
Thermal response of an on-chip assembly of RTD heaters, sputtered sample and microthermocouples
-
M. Imran, and A. Bhattacharyya Thermal response of an on-chip assembly of RTD heaters, sputtered sample and microthermocouples Sensor Actuator 121 2005 306 320
-
(2005)
Sensor Actuator
, vol.121
, pp. 306-320
-
-
Imran, M.1
Bhattacharyya, A.2
-
20
-
-
84861793984
-
Physics of aging in thin-film resistors
-
Crossland WA, Marr CA, Roettgers HT. Physics of aging in thin-film resistors. Oxidation of clean chromium films, United States Clearinghouse for Federal Scientific and Technical Information, AD Report, (AD 651375); 1967. p. 148.
-
(1967)
Oxidation of Clean Chromium Films, United States Clearinghouse for Federal Scientific and Technical Information, AD Report, (AD 651375)
, pp. 148
-
-
Crossland, W.A.1
Marr, C.A.2
Roettgers, H.T.3
-
21
-
-
53749105734
-
Experiments and modeling of heat transfer from an on-chip resistance temperature detector
-
J.W. Post, A. Bhattacharyya, and M. Imran Experiments and modeling of heat transfer from an on-chip resistance temperature detector Appl Therm Eng 29 2009 116 130
-
(2009)
Appl Therm Eng
, vol.29
, pp. 116-130
-
-
Post, J.W.1
Bhattacharyya, A.2
Imran, M.3
-
22
-
-
33845608800
-
Effect of thin film thicknesses and materials on the response of RTDs and microthermocouples
-
M. Imran, and A. Bhattacharyya Effect of thin film thicknesses and materials on the response of RTDs and microthermocouples IEEE Sensor J 6 6 2006 1459 1467
-
(2006)
IEEE Sensor J
, vol.6
, Issue.6
, pp. 1459-1467
-
-
Imran, M.1
Bhattacharyya, A.2
-
23
-
-
10044255572
-
Analytical approach for characterization of sputtered thin film microthermocouples (STFMT)
-
5389 (smart electronics, MEMS, BioMEMS, and nanotechnology)
-
Imran M, Bhattacharyya A. Analytical approach for characterization of sputtered thin film microthermocouples (STFMT). In: Proceedings of SPIE-The international society for optical engineering, 5389 (smart electronics, MEMS, BioMEMS, and nanotechnology); 2004. p. 411-21.
-
(2004)
Proceedings of SPIE-The International Society for Optical Engineering
, pp. 411-421
-
-
Imran, M.1
Bhattacharyya, A.2
-
24
-
-
51149083887
-
-
M. Imran, and A. Bhattacharyya A steady state, thermal model of an on-chip assembly of RTD heaters, sputtered sample and microthermocouples, Ferroelectrics 342 2006 107 127
-
(2006)
A Steady State, Thermal Model of An On-chip Assembly of RTD Heaters, Sputtered Sample and Microthermocouples, Ferroelectrics
, vol.342
, pp. 107-127
-
-
Imran, M.1
Bhattacharyya, A.2
-
26
-
-
51149111164
-
Short-term saline soak tests to determine the reliability of a thin film micro-heater
-
J. Post, and A. Bhattacharyya Short-term saline soak tests to determine the reliability of a thin film micro-heater Microelectron Reliab 48 2008 1673 1682
-
(2008)
Microelectron Reliab
, vol.48
, pp. 1673-1682
-
-
Post, J.1
Bhattacharyya, A.2
-
27
-
-
0003998388
-
-
86th ed. Taylor and Francis, Boca Raton, FL
-
DR Lide, editor, CRC handbook of chemistry and physics, Internet Version 2006, < http://www.hbcpnetbase.com >, 86th ed. Taylor and Francis, Boca Raton, FL; 2006. p. 12-39.
-
(2006)
CRC Handbook of Chemistry and Physics, Internet Version 2006
, pp. 12-39
-
-
Lide, D.R.1
-
28
-
-
25144467022
-
An experimental investigation of the electrical resistivity of Titatnium in the temperature range from 77 to 1600 K
-
E.A. Bel'skaya An experimental investigation of the electrical resistivity of Titatnium in the temperature range from 77 to 1600 K Therm Prop Mater 43 2005 546 553
-
(2005)
Therm Prop Mater
, vol.43
, pp. 546-553
-
-
Bel'Skaya, E.A.1
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