Thermal response of an on-chip assembly of RTD heaters, sputtered sample and microthermocouples

Sensors and Actuators, A: Physical

Volumn 121, Issue 2, 2005, Pages 306-320

  Imran, Muhammad ^a   Bhattacharyya, Abhijit ^a  

^a University of Arkansas   (United States)

Author keywords

Convection coefficient; Heat transfer coefficient; Microthermocouple; Relative Seebeck coefficient; RTD; Thermopile; Thin film

Indexed keywords

ASSEMBLY; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; SEEBECK EFFECT; SPUTTERING; TEMPERATURE MEASUREMENT; THERMAL EFFECTS; THERMOCOUPLES; THIN FILMS;

HEAT TRANSFER MODELS; MICROTHERMOCOUPLES (MT); RELATIVE SEEBACK COEFFICIENT; RESISTANCE TEMPERATURE DETECTORS (RTD);

HEATING EQUIPMENT;

EID: 19744377807     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2005.02.019     Document Type: Article

References (23)

1. M.G. Faulkner, J.J. Amalraj, and A. Bhattacharyya Experimental determination of thermal and electrical properties of Ni-Ti shape memory wires Smart Mater. Struct. 9 2000 632 639
2. T. Borca-Tasciuc, and G. Chen Thin-film thermophysical property characterization by scanning laser thermoelectric microscope Int. J. Thermophys. 19 2 1998 557 567
3. J.L. Hostetler, A.N. Smith, and P.M. Norris Thin-film thermal conductivity and thickness measurements using picosecond ultrasonics J. Microscale Thermophys. Eng. 1 3 1997 237 244
4. A. Maesono, Y. Takasaki, Y. Maeda, R.P. Tye, J. Morikawa, and T. Hashimoto A new apparatus for thermal diffusivity and specific heat measurements of films and liquids by means of Fourier transform thermal analysis Proc. High Temp. High Pressures 34 2 2002 127 134
5. D.G. Cahill Heat transport in dielectric thin films and at solid-solid interfaces J. Microscale Thermophys. Eng. 1 2 1997 85 109
6. E. Jansen, and E. Obermeier Thermal conductivity measurements on thin films based on micromechanical devices J. Micromech. Microeng. 6 1996 118 121
7. K.E. Goodson, and M.I. Flik Solid layer thermal conductivity measurement techniques Appl. Mechan. Rev. 47 1994 101 112
8. A. Majumdar Microscale heat conduction in dielectric thin films J. Heat Transfer 115 1993 7 16
9. M.I. Flik, B.I. Choi, and K.E. Goodson Heat transfer regimes in microstructures J. Heat Transfer 114 1992 666 674
10. C.L. Tien, and G. Chen Challenges in microscale conductive and radiative heat transfer J. Heat Transfer 116 1994 799 807
11. J.R. Taylor An introduction to Error Analysis - The Study of Uncertainties in Physical Measurements second ed. 1998 University Science Books CA 100
12. A. Dziedzic, L.J. Golonka, J. Kozlowski, B.W. Licznerski, and K. Nitsch Thick-film resistive temperature sensors Meas. Sci. Technol. 8 1 1997 78 85
13. NIST Technical Note 1411, Reproducibility of the Temperature of the Ice Point in Routine Measurements, June 1995.
14. http://www.minco.com/
15. M. Imran, A. Bhattacharyya, E. Porter, Experimental characterization of thin film microthermocouples to determine thermophysical properties of materials, in: Proceedings of 37th International Symposium on Microelectronics and Packaging, 2004, 7 pp.
16. D.D. Pollock Thermocouples - Theory and Properties 1991 CRC Press Boca Raton, FL p. 3
17. J.P. Moore, R.K. Williams, and R.S. Graves Thermal conductivity, electrical resistivity, and Seebeck coefficient of high-purity chromium from 280 to 1000 K J. Appl. Phys. 48 2 1997 610 617
18. D.M. Rowe CRC Handbook of Thermoelectrics 1995 CRC Press LLC NY 390
19. Q. Hao Analytical heat-transfer modeling of multilayered microdevices J. Micromech. Microeng. 14 7 2004 914 926
20. F.P. Incropera, and D.P. DeWitt Fundamentals of Heat and Mass Transfer third ed. 1990 John Wiley & Sons NY p. 554
21. S.W. Churchill, and H.H.S. Chu Correlating equations for laminates and turbulent free convection from a horizontal cylinder Int. J. Heat Mass Transfer 18 1975 49 53
22. G.S. Shu, D.C. Lagoudas, D. Hughes, and J.T. Wen Modeling of a flexible beam actuated by SMA wires Smart Mater. Struct. 6 1997 1243 1282
23. L.E. Malvern, Introduction to the Mechanics of a Continuous Medium, Prentice-Hall, NJ, 1969, p. 226.