Improved thermal stability of copper vias using a cyclical stress test

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 283-287

  Alers, G B ^a   Kuo, J J ^b   Harm, G ^a   Weinzierl, S R ^b   Ray, G W ^a  

^a Novellus Systems   (United States)

^b Keithley Instruments Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE RATE; THERMAL CONTRACTION; VIA STRESS MIGRATION (VSM); WAFER-WAFER VARIATIONS;

CREEP; DIFFUSION; MATHEMATICAL MODELS; PHOTORESISTS; TENSILE STRESS; THERMODYNAMIC STABILITY;

COPPER;

EID: 4043133247     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. E.T. Ogawa, J.W. McPherson et al, Proc. Int'l Rel. Phys. Symp., 2002, pp.312.
2. J.W. McPherson and C.F. Dunn, J. Vac. Sci. & Tech B5(5), 1987, pp.1321
3. S.H. Ree, Y.Du, and P.S.Ho, Proc. Int. Intconnect Tech. Conf. 2001, pp. 89-92
4. K. Doong, R. Wang et al., Proc. Int'l Rel. Phys. Symp., 2003, pp.156.