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J. C. Lin, W. C. Chiou, K. F. Yang, H. B. Chang, Y. C. Lin, E. B. Liao, J. P. Lin, Y. L. Lin, P. H. Tsai, Y. C. Shih, T. J. Wu, W. J. Wu, F. W. Tsai, Y. H. Huang, T. Y. Wang, C. L. Yu, C. H. Chang, M. F. Chen, S. Y. Hou, C. H. Tung, S. P. Jeng, and D. C. H. Yu: Proc. IEDM Tech. Dig., 2010, 2.1.1.
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Proc. IEDM Tech. Dig.
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Lin, J.C.1
Chiou, W.C.2
Yang, K.F.3
Chang, H.B.4
Lin, Y.C.5
Liao, E.B.6
Lin, J.P.7
Lin, Y.L.8
Tsai, P.H.9
Shih, Y.C.10
Wu, T.J.11
Wu, W.J.12
Tsai, F.W.13
Huang, Y.H.14
Wang, T.Y.15
Yu, C.L.16
Chang, C.H.17
Chen, M.F.18
Hou, S.Y.19
Tung, C.H.20
Jeng, S.P.21
Yu, D.C.H.22
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H. Kitada, N. Maeda, K. Fujimoto, Y. Mizushima, Y. Nakata, T. Nakamura, W. Lee, Y. S. Kwon, and T. Ohba: Proc. IEEE Int. Interconnect Technology Conf., 2010, p. 1.
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Proc. IEEE Int. Interconnect Technology Conf.
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Mizushima, Y.4
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Kwon, Y.S.8
Ohba, T.9
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H. Kitada, N. Maeda, K. Fujimoto, Y. Mizushima, Y. Nakata, T. Nakamura, and T. Ohba: Jpn. J. Appl. Phys. 50 (2011) 05ED02.
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Jpn. J. Appl. Phys.
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to be published in
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D. Diehl, H. Kitada, N. Maeda, K. Fujimoto, S. Ramaswami, K. Sirajuddin, R. Yalamanchili, B. Eaton, N. Rajagopalan, R. Ding, S. Patel, Z. Cao, M. Gage, Y. Wang, W. Tu, S. W. Kim, R. Kulzer, I. Drucker, D. Erickson, T. Ritzdorf, T. Nakamura, and T. Ohba: to be published in Microelectron. Eng. (2011).
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Microelectron. Eng.
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Fujimoto, K.4
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Eaton, B.8
Rajagopalan, N.9
Ding, R.10
Patel, S.11
Cao, Z.12
Gage, M.13
Wang, Y.14
Tu, W.15
Kim, S.W.16
Kulzer, R.17
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Nakamura, T.21
Ohba, T.22
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Proc. Int. Conf. Electronic Packaging Technology and High Density Packaging
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Park, J.H.2
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Microelectron. Eng.
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H. Kitada, N. Maeda, K. Fujimoto, K. Suzuki, A. Kawai, K. Arai, T. Suzuki, T. Nakamura, and T. Ohba: Proc. IEEE Int. Interconnect Technology Conf., 2009, p. 107.
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Proc. IEEE Int. Interconnect Technology Conf.
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Kitada, H.1
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Fujimoto, K.3
Suzuki, K.4
Kawai, A.5
Arai, K.6
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Nakamura, T.8
Ohba, T.9
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K. Fujimoto, N. Maeda, H. Kitada, K. Suzuki, T. Nakamura, and T. Ohba: Proc. Solid-State Sensors, Actuators and Microsystems Conf., 2009, p. 1877.
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Proc. Solid-State Sensors Actuators and Microsystems Conf.
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Fujimoto, K.1
Maeda, N.2
Kitada, H.3
Suzuki, K.4
Nakamura, T.5
Ohba, T.6
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84861489966
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Y. S. Kim, A. Tsukune, N. Maeda, H. Kitada, A. Kawai, K. Arai, K. Fujimoto, K. Suzuki, Y. Mizushima, T. Nakamura, T. Ohba, T. Futatsugi, and M. Miyajima: IEDM Tech. Dig., 2009, p. 1.
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Kim, Y.S.1
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Fujimoto, K.7
Suzuki, K.8
Mizushima, Y.9
Nakamura, T.10
Ohba, T.11
Futatsugi, T.12
Miyajima, M.13
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N. Maeda, H. Kitada, K. Fujimoto, K. Suzuki, T. Nakamura, A. Kawai, K. Arai, and T. Ohba: Proc. VLSI Technology Systems and Applications, 2010, p. 158.
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Proc. VLSI Technology Systems and Applications
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Maeda, N.1
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Nakamura, T.5
Kawai, A.6
Arai, K.7
Ohba, T.8
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H. Kitada, Y. Morikawa, N. Maeda, K. Fujimoto, S. Kodama, Y. Mizushima, T. Nakamura, and T. Ohba: Ext. Abstr. 28th Advanced Metallization Conf., 2011.
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Ext. Abstr. 28th Advanced Metallization Conf.
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Kitada, H.1
Morikawa, Y.2
Maeda, N.3
Fujimoto, K.4
Kodama, S.5
Mizushima, Y.6
Nakamura, T.7
Ohba, T.8
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