Stress sensitivity analysis on TSV structure of wafer-on-a-wafer (WOW) by the finite element method (FEM)

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 107-109

  Kitada, H ^a   Maeda, N ^a   Fujimoto, K ^b   Suzuki, K ^b   Kawai, A ^c   Arai, K ^c   Suzuki, T ^d   Nakamura, T ^d   Ohba, T ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b DAI NIPPON PRINTING CO LTD   (Japan)

^c DISCO CORPORATION   (Japan)

^d FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE LAYERS; BEOL STRUCTURES; CRITICAL POINTS; KEY FACTORS; MECHANICAL RELIABILITY; MECHANICAL STRESS; SI WAFER; STRESS SENSITIVITY; STRUCTURAL INTEGRATION; THERMAL EXPANSION COEFFICIENTS;

EQUATIONS OF STATE; SEMICONDUCTING SILICON COMPOUNDS; SENSITIVITY ANALYSIS; SILICON WAFERS; STRESSES; THERMAL EXPANSION;

FINITE ELEMENT METHOD;

EID: 70349463104     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090354     Document Type: Conference Paper

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