Elimination of nanovoids induced during electroforming of metallic nanostamps with high-aspect-ratio nanostructures by the pulse reverse current electroforming process

Journal of Micromechanics and Microengineering

Volumn 22, Issue 6, 2012, Pages

  Han, Jungjin ^a   Han, Jeongwon ^a   Lee, Byung Soo ^a   Lim, Jiseok ^a   Kim, Seok Min ^b   Kim, Hansung ^a   Kang, Shinill ^a  

^a Yonsei University   (South Korea)

^b Chung Ang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT WAVEFORMS; DIRECT CURRENT; HIGH ASPECT RATIO; HIGH CURRENTS; NANO-VOIDS; REVERSE CURRENTS; UNIFORM CURRENT DISTRIBUTION; VOID-FREE;

ASPECT RATIO; DEGRADATION; ELECTRIC CURRENT DISTRIBUTION MEASUREMENT; ELECTROCHEMISTRY; ELECTROMETALLURGY; NANOSTRUCTURES;

ELECTROFORMING;

EID: 84861406706     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/22/6/065004     Document Type: Article

References (28)

1. Hung P J, Lee P P, Sabounchi P, Aghdam N, Lin R and Lee L P 2005 A novel high aspect ratio microfluidic design to provide a stable and uniform microenvironment for cell growth in a high throughput mammalian cell culture array Lab Chip 5 448 (Pubitemid 40139339)
2. Lee J, Je T, Choi D, Lee S, Le D and Kim S 2010 Micro grooving simulation and optimization in the roughing stage Int. J. Precis. Eng. Manuf. 11 3618
3. Hu W, Sarveswaran K, Lieberman M and Bernstein G H 2004 Sub-10 nm electron beam lithography using cold development of poly J. Vac. Sci. Technol B 22 17116
4. Enkrich C, Pérez-Willard F, Gerthsen D, Zhou J, Koschny T, Soukoulis C M, Wegener M and Linden S 2005 Focused-ion-beam nanofabrication of near-infrared magnetic metamaterials Adv. Mater. 17 25479 (Pubitemid 41587520)
5. Yu F, Li P, Shen H, Mathur S, Lehr C M, Bakowsky U and Mucklich F 2005 Laser interference lithography as a new and efficient technique for micropatterning of biopolymer surface Biomaterials 26 230712 (Pubitemid 39600684)
6. Piner R D, Zhu J, Xu F, Hong S and Mirkin C A 1999 Dip-pen nanolithography Science 283 6613 (Pubitemid 29074998)
7. Chou S Y and Krauss P R 1997 Imprint lithography with sub-10 nm feature size and high throughput Microelec. Eng. 35 23740 (Pubitemid 127367124)
8. Lee N, Han J, Lim J, Choi M, Han Y, Hong J and Kang S 2008 Injection molding of nanopillars for perpendicular patterned magnetic media with metallic nanostamp Japan. J. Appl. Phys. 47 18035
9. Lee N, Kim Y and Kang S 2004 Fabrication of metallic nano-stamper and replication of nano-patterned substrate for patterned media Nanotechnology 15 9016
10. Chandrasekar M S and Pushpavanam M 2008 Pulse and pulse reverse plating - conceptual, advantages and applications Electrochim. Acta 53 331322
11. Wang J Y, Balamurugan D and Chin D-T 1992 An experimental study of mass transfer in pulse reversal plating J. Appl. Electrochem. 22 2406
12. Georgiadou M and Veyret D 2002 Modeling of transient electrochemical systems involving moving boundaries J. Electrochem. Soc. 149 C32430 (Pubitemid 34697439)
13. Chang L M 2008 Diffusion layer model for pulse reverse plating J. Alloys Compd. 466 L1922
14. Schlesinger M and Paunovic M 2010 Modern Electroplating (New York: Wiley) pp 133
15. Dixit P, Miao J and Preisser R 2006 Fabrication of high aspect ratio 35 m pitch through-wafer copper interconnects by electroplating for 3D wafer stacking Electrochem. Solid-State Lett. 9 G3058 (Pubitemid 44270901)
16. Gu C, Xu H and Zhang T 2009 Fabrication of high aspect ratio through-wafer copper interconnects by reverse pulse electroplating J. Micromech. Microeng. 19 065011
17. Ayón A A, Braff R, Lin C C, Sawin H H and Schmidt M A 1999 Characterization of a time multiplexed inductively coupled plasma etcher J. Electrochem. Soc. 146 33949
18. Han J, Yang J M, Shin S C, Kim Y J and Kang S 2009 Design and fabrication of perpendicular patterned magnetic media using nanoimprinted nano pillar patterns IEEE Trans. Magn. 45 228891
19. Kim H, Shin S C, Han J, Han J and Kang S 2009 Fabrication of metallic nano stamp to replicate patterned substrate using electron-beam recording, nanoimprinting and electroforming IEEE Trans. Magn. 45 23047
20. Burek M J and Greer J R 2010 Fabrication and microstructures control of nanoscale mechanical testing specimens via electron beam lithography and electroplating Nano Lett. 10 6976
21. Cho S K, Kim M J, Lim T, Kwon O J and Kim J J 2011 Deposit profiles characterized by the seed layer in Cu pulse-reverse plating on a patterned substrate J. Vac. Sci. Technol. B 29 011004
22. Ibl N 1980 Some theoretical aspects of pulse electrolysis Surf. Tech. 10 81104 (Pubitemid 10461118)
23. Georgiadou M, Veyret D, Sani R L and Alkire R C 2001 Simulation of shape evolution during electrodeposition of copper in the presence of additive J. Electrochem. Soc. 148 C548 (Pubitemid 32189337)
24. Kalantary M R, Gabe D R and Goodenough M R 1993 Unipolar and bipolar pulsed current electrodeposition for PCB production J. Appl. Electrochem. 23 23140
25. Datta M and Landolt D 2000 Fundamental aspects and applications of electrochemical microfabrication Electrochim. Acta 45 253558
26. Lee J, Hachman J T, Kelly J J Jr and West A C 2004 Improvement of current distribution uniformity on substrates for microelectromechanical systems J. Microlith. Microfab. Microsyst. 3 14651
27. West C A, Cheng C and Baker B C 1998 Pulse reverse copper electrodeposition in high aspect ratio trenches and vias J. Electrochem Soc. 145 30704 (Pubitemid 128634216)
28. Tasi W, Wan C and Wan Y 2003 Frequency effect of pulse plating on the uniformity of copper deposition in plated through holes J. Electrochem. Soc. 150 C26772