E-beam inspection system for comparison of wafer and design data

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8324, Issue , 2012, Pages

  Patterson, Oliver D ^a   Lee, Julie ^a   Monkowski, Michael D ^a   Ryan, Deborah A ^a   Chen, Shih Tsung ^b   Lei, Shuen Cheng ^b   Wang, Fei ^b   Lee, Chung Han ^b   Tomlinson, Derek ^b   Fang, Wei ^b   Jau, Jack ^b  

^a IBM MICROELECTRONICS   (United States)

^b Hermes Microvision Inc   (United States)

Author keywords

D2DB; Die to database Inspection; E beam; Hot spot inspection; OPC check; Pattern fidelity Inspection; Patterning; PWC; PWQ

Indexed keywords

D2DB; DATABASE INSPECTION; E-BEAM; HOT SPOT; OPC CHECK; PATTERN FIDELITY; PATTERNING; PWC; PWQ;

LITHOGRAPHY; PROCESS CONTROL; SEMICONDUCTOR DEVICE MANUFACTURE; UNITS OF MEASUREMENT;

INSPECTION;

EID: 84861040351     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.918072     Document Type: Conference Paper

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