Optimization of pitch-split double patterning phoresist for applications at the 16nm node

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn , Issue , 2011, Pages

  Holmes, Steven J ^a   Tang, Cherry ^c   Burns, Sean ^b   Yin, Yunpeng ^a   Chen, Rex ^a   Koay, Chiew Seng ^a   Kini, Sumanth ^d   Tomizawa, Hideyuki ^e   Chen, Shyng Tsong ^a   Fender, Nicolette ^c   Osborn, Brian ^c   Singh, Lovejeet ^c   Petrillo, Karen ^a   Landie, Guillaume ^a   Halle, Scott ^a   Liu, Sen ^a   Arnold, John C ^b   Spooner, Terry ^b   Varanasi, Rao ^a   Slezak, Mark ^c   Colburn, Matthew ^b   Dunn, Shannon ^f   Hetzer, David ^g   Kawakami, Shinichiro ^g   Cantone, Jason ^f   more..

^a IBM   (United States)

^b IBM RESEARCH   (United States)

^c JSR Micro   (United States)

^d KLA Tencor   (United States)

^e TOSHIBA CORPORATION   (Japan)

^f TOKYO ELECTRON AMERICA INC   (United States)

^g TEL TECHNOLOGY CENTER   (United States)

Author keywords

16 nm node lithography; double patterning; pitch split; thermal cure; tone inversion

Indexed keywords

16 NM NODE LITHOGRAPHY; DOUBLE PATTERNING; PITCH-SPLIT; THERMAL CURE; TONE INVERSION;

CURING; LITHOGRAPHY; MANUFACTURE; NANOTECHNOLOGY; SEMICONDUCTOR DEVICE MANUFACTURE;

SEMICONDUCTOR DEVICES;

EID: 79960365177     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.2011.5898203     Document Type: Conference Paper

References (7)

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6. C-K. Koay, S. Holmes, K. Petrillo, M. Colburn, S. Burns, S. Dunn, J. Cantone, D. Hetzer, S. Kawakami, Y. Van Dommelen, A. Jiang, M. Many, R. Routh, L. Huli, B. Martinick, M. Rodgers, H. Tomizawa, S. Kini, "Evaluation of double-patterning techniques for advanced logic nodes" Proc. SPIE, Vol. 7640, (2010); DOI:10.1117/12.846769
7. C-K. Koay, S. Halle, S. Holmes, K. Petrillo, M. Colburn, S. Dunn, J. Cantone, D. Hetzer, S. Kawakami, Y. Van Dommelen, A. Jiang, M. Crouse, L. Huli, B. Martinick, M. Rodgers, "Towards manufacturing of advanced logic devices by double patterning" Proc. SPIE, (2011), in press.