Growth characteristic study of intermetallic compounds growth in nanoscale-thickness Cu/Sn/Cu sandwich structure

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Volumn , Issue , 2011, Pages 289-293

  Li, Qingqian ^a   Chan, Y C ^a   Ismathullakhan, Shafiq ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

AGING PROCESS; GROWTH CHARACTERISTIC; MICRO-SCALES; NANO SCALE; PARABOLIC CURVE; REFLOW PROCESS; REFLOW--SOLDERING; SOLDER LAYERS; SUBMICRON;

ELECTRONICS PACKAGING; FLIP CHIP DEVICES; NANOTECHNOLOGY; SANDWICH STRUCTURES; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 84860910955     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2011.6184433     Document Type: Conference Paper

References (17)

1. Mitsuo Umemoto, Kazumasa Tanida, Yoshihiko Nemoto, Masataka Hoshino, "High-Performance Vertical Interconnection for high-density 3D Chip Stacking Package," Electronic Components and Technology Confelrence, 2004, pp. 616-623.
2. T.A. Siewert, J.C. Madeni and S. Liu, "Formation and Growth of Intermetallics at the Interface Between Lead-free Solders and Copper Substrates", Proceedings of the APEX Conference on Electronics Manufacturing, Anaheim, California, April, 2003, pp. 583-594.
3. Y.C. Chan, Alex C.K. So, J.K.L. Lai, "Growth kinetic studies of Cu-Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints", Materials Science and Engineering, Vol. B55 (1998), pp. 5-13
4. P.L. Tu, Y.C. Chan, K.C. Hung and J.K.L. Lai, "Growth Kinetics of Intermetallic Compounds in Chip Scale Package Solder Joint", Scripta mater. Vol. 44 (2001), pp. 317-323
5. Xin Ma, Fengjiang Wang, Yiyu Qian, Fusahito Yoshida, "Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface", Materials Letters Vol. 57 (2003), pp. 3361-3365
6. Zhihong Huang, Ritwik Chatterjee, Patrick Justison, Richard Hernandez, Scott Pozder, Ankur Jain, Eddie Acosta, Donald A. Gajewski, Varughese Mathew and Robert E. Jones, "Electromigration of Cu-Sn-Cu Micropads in 3D Interconnect", Electronic Components and Technology Conference, 2008, pp. 12-17
7. MENG Gong-ge, T. Takemoto, H. Nishikawa, "Correlations between IMC thickness and three factors in Sn-3Ag-OSCu alloy system", Trans. Nonferrous Met. Soc. China, Vol. 17 (2007), pp. 686-690
8. Ahmed Sharif, Y.C. Chan, "Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints", Microelectronic Engineering Vol. 84 (2007), pp. 328-335
9. Tao Liu, D. Kim, D. Leung, M.A. Korhonen and C.-Y. Li, "High Sn Solder Reaction with Cu Metallization", Scripta Materialia, Vol. 35, No. 1 (1996), pp. 65-69
10. G. Y. Li and Y. C. Chan, "Interactions between Silver-Palladium Metallization and Tin-Lead-Silver Solder", Phys. Sta. Sol. (a). (1998), Vol. 166, R13
11. C. Y. Lee and K. L. Lin, "Preparation of solder bumps incorporating electroless nickel-boron deposit and investigation on the interfacial interaction behaviour and wetting kinetics", Journal of Materials Science -Materials in Electronics, Vol 8 (6), pp. 377-383
12. Weiqun Peng, Eduardo Monlevade, Marco E. Marques, "Effect of thermal aging on the interfacial structure of SnAgCu solder joints on Cu", Microelectronics Reliability, Vol. 47 (2007), pp.2161-2168
13. Satyanarayan, K.N. Prabhu, "Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn-Cu solder alloy", Advances in Colloid and Interface Science Vol. 166 (2011), pp. 87-118
14. Zeng K, Stierman R, Chiu T-C, Edwards D, Ano K, Tu KN. "Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability", J Appl Phys 2005, 97:024508
15. R.E. Pratt, E.I. Stromswold, D.J. Quesnel, "Mode I fracture toughness testing of eutectic Sn-Pb solder joints", J. Elect. Mater. Vol. 23 (4) (1994), pp.375-381
16. K.N. Tu, "Cu/Sn interfacial reactions' thin-film case versus bulk case", Materials Chemistry and Physics, Vol. 46 (1996), pp.217-223
17. Y.C. Chan, D. Yang, "Failure mechanisms of solder interconnects under current streesing in advanced electronic packages", Progress in Materials Science, Vol 55 (2010), pp. 428-275