Correlations between IMC thickness and three factors in Sn-3Ag-0.5Cu alloy system

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 17, Issue 4, 2007, Pages 686-690

  MENG, Gong ge ^a,b   Takemoto, T ^a,b   Nishikawa, H ^a,b  

^a HARBIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

IMC thickness; lead free solder; Sn Ag Cu alloy; uniform design

Indexed keywords

COMPUTER AIDED DESIGN; CORRELATION METHODS; NICKEL COMPOUNDS; NONLINEAR ANALYSIS; TEMPERATURE MEASUREMENT; THICKNESS MEASUREMENT; TIN ALLOYS;

IMC THICKNESS; LEAD-FREE SOLDER; UNIFORM DESIGN;

SOLDERING ALLOYS;

EID: 34548774431     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(07)60157-5     Document Type: Article

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