Mechanical strength of silicon wafers cut by loose abrasive slurry and fixed abrasive diamond wire sawing

Advanced Engineering Materials

Volumn 14, Issue 5, 2012, Pages 342-348

  Wu, Hao ^a   Melkote, Shreyes N ^a   Danyluk, Steven ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABRASIVE SLURRIES; APPLIED STRESS; BIAXIAL FLEXURE; CENTER CRACKS; CRACK DENSITY; CRACK LENGTH; CRACK ORIENTATIONS; CRITICAL CRACK LENGTHS; DIAMOND WIRE; DIAMOND WIRE SAWING; EDGE CRACKS; FIXED ABRASIVES; WAFER EDGE;

ABRASION; ABRASIVES; BENDING TESTS; CRACK PROPAGATION; FRACTURE; MICROCRACKS; POLYSILICON;

SILICON WAFERS;

EID: 84860810877     PISSN: 14381656     EISSN: 15272648     Source Type: Journal    
DOI: 10.1002/adem.201100263     Document Type: Article

References (24)

1. H. J. Möller, C. Funke, M. Rinio, S. Scholz, Thin Solid Films 2005, 487, 179.
2. R. F. Cook, J. Mater. Sci. 2006, 41, 841.
3. P. A. Wang, Proc. 4th WCPEC, Waikoloa, HI, USA, 2006, p. 1179.
4. H. J. Möller, Phys. Status Solidi A 2006, 203 (4), 659.
5. F. Yang, I. Kao, ASME J. Electron. Packag. 2001, 123, 254.
6. K. Bidiville, J. Wasmer, P. Michler, M. Nasch, M. Van der Meer, C. Ballif, Prog. Photovolt.: Res. Appl. 2010, 18, 563.
7. Y. Kondo, N. Watanabe, D. Ide, T. Matsuki, H. Takato, I. Sakata, Proc. 23rd EUPVSEC, Valencia, Spain, 2008, p. 1297.
8. N. Watanabe, Y. Kondo, D. Ide, T. Matsuki, H. Takato, I. Sakata, Prog. Photovolt.: Res. Appl. 2010, 18, 485.
9. A. Bidiville, K. Wasmer, R. Kraft, C. Ballif, Proc. 24th EUPVSEC, 2CV.1, Hamburg, Germany, 2009, p. 86.
10. X. Brun, S. Melkote, Sol. Energy Mater. Sol. Cells 2009, 93, 1238.
11. P. Rupnowski, B. Sopori, Int. J. Fracture 2009, 155, 67.
12. H. Behnken, M. Apel, D. Franke, Proc. 3rd WCPEC, Osaka, Japan, 2003, p. 1308.
13. A. Hayter, Probability and Statistics for Engineers and Scientists, Duxbury, California 2002.
14. B. Yeung, T. Y. Lee, IEEE Trans. Compon. Packag. Technol. 2003, 26 (2), 423.
15. T. L. Anderson, Fracture Mechanics: Fundamentals and Applications, Talyor & Francis Group, Florida 2005.
16. W. A. Weibull, A statistical Theory of Strength of Materials, Royal Swedish Institute for Engineering Research, Stockholm, Sweden 1959.
17. Standard practice for reporting uniaxial strength data and estimating Weibull distribution parameters for advanced ceramics, C1239-07. ASTM, Philadelphia, PA, USA, 2007.
18. H. Tada, P. C. Paris, G. R. Irwin, (Eds), The Stress Analysis Handbook, ASME Press, New York 2000.
19. C. P. Chen, M. H. Leipold, Am. Ceram. Soc. Bull. 1980, 59, 469.
20. J. Bagdahn, J. Schischka, M. Petzold, W. N. Sharpe, Proc. SPIE 2004, 5581, 159.
21. I. Chasiotis, S. W. Cho, K. Jonnalagadda, ASME J. Appl. Mech. 2006, 73, 714.
22. Tentative test method for biaxial flexure strength (modulus of rupture) of ceramic substrates, F394-74T. ASTM, Philadelphia, PA, USA, 1974.
23. C. Funke, E. Kullig, M. Kuna, H. J. Möller, Adv. Eng. Mater. 2004, 6 (7), 594.
24. K. Mcguire, S. Danyluk, T. L. Baker, J. W. Rupnow, D. Mclaughin, J. Mater. Sci. 1997, 32, 1017.