Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire

Progress in Photovoltaics: Research and Applications

Volumn 18, Issue 7, 2010, Pages 485-490

  Watanabe, N ^a   Kondo, Y ^a   Ide, D ^b   Matsuki, T ^b   Takato, H ^c   Sakata, I ^c  

^a Noritake Co Limited   (Japan)

^b Noritake Super Abrasive Co Ltd   (Japan)

^c NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Fixed abrasive wire; Lifetime; Polycrystalline silicon; Silicon solar cell; Wire saw

Indexed keywords

BARE WIRES; CRYSTALLINE SILICONS; DIAMOND GRITS; ETCHING DEPTH; FIXED-ABRASIVE WIRE; LIFETIME; PHOTOVOLTAIC PROPERTY; POLY-CRYSTALLINE SILICON; POLYCRYSTALLINE SILICON SOLAR CELL; POLYCRYSTALLINE SILICON WAFERS; SILICON CELLS; WAFER SLICING; WAFER THICKNESS; WIRE SAW;

ABRASIVES; METAL CASTINGS; POLYSILICON; RESINS; SEMICONDUCTING SILICON COMPOUNDS; SILICON SOLAR CELLS; SOLAR CELLS; SOLAR POWER GENERATION; WAFER BONDING; WIRE;

SILICON WAFERS;

EID: 79954560301     PISSN: 10627995     EISSN: 1099159X     Source Type: Journal    
DOI: 10.1002/pip.923     Document Type: Article

References (7)

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