Analysis of stresses and breakage of crystalline silicon wafers during handling and transport

Solar Energy Materials and Solar Cells

Volumn 93, Issue 8, 2009, Pages 1238-1247

  Brun, Xavier F ^a   Melkote, Shreyes N ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Breakage; Crystalline; Silicon; Stresses; Wafer handling

Indexed keywords

BREAKAGE; BREAKAGE ANALYSIS; BREAKAGE TESTS; CRACK LENGTH; CRACK SIZES; CRYSTALLINE; CRYSTALLINE SILICON WAFERS; EDGE-DEFINED FILM-FED GROWTH; FRACTURE STRESS; IN-PLANE STRESS; LINEAR ELASTIC FRACTURE MECHANICS; NON-LINEAR FINITE-ELEMENT ANALYSIS; PROCESS STEPS; SOLAR CELL MANUFACTURE; SQUARE ROOTS; STRESS STATE; STRUCTURAL DEFECT; WAFER DEFORMATION; WAFER HANDLING;

BRITTLE FRACTURE; COAL BREAKAGE; CRACK DETECTION; CRYSTALLINE MATERIALS; FILM GROWTH; FRACTURE MECHANICS; SEMICONDUCTING SILICON COMPOUNDS; STRENGTH OF MATERIALS; STRESSES;

SILICON WAFERS;

EID: 67349155606     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2009.01.016     Document Type: Article

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