Biaxial fracture test of silicon wafers

Advanced Engineering Materials

Volumn 6, Issue 7, 2004, Pages 594-598

  Funke, Claudia ^a   Kullig, Eckehard ^a   Kuna, Meinhard ^a   Möller, Hans Joachim ^a  

^a TU BERGAKADEMIE FREIBERG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING TOOLS; ELASTICITY; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INGOTS; PLATE METAL; SAWING; SOLAR CELLS; STATISTICAL METHODS; STRESSES; WEIBULL DISTRIBUTION;

BIAXIAL FRACTURE; CRACK DENSITY; FRACTURE STRESSES; WAFERS;

SILICON WAFERS;

EID: 4043048698     PISSN: 14381656     EISSN: None     Source Type: Journal    
DOI: 10.1002/adem.200400406     Document Type: Article

References (10)

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6. F. Duderstadt, Ph.D. dissertation, TU Berlin, 2003.
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