The influence of backgrinding on the fracture strength of 100 mm diameter (111)p-type silicon wafers

Journal of Materials Science

Volumn 32, Issue 4, 1997, Pages 1017-1024

  McGuire, K ^a   Danyluk, S ^a,c   Baker, T L ^b   Rupnow, J W ^b   McLaughlin, D ^b  

^a UNIVERSITY OF ILLINOIS AT CHICAGO   (United States)

^b MOTOROLA INC   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL ORIENTATION; ETCHING; FRACTURE TOUGHNESS; GRINDING (COMMINUTION); OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY;

BACKGRINDING;

SILICON WAFERS;

EID: 0031079004     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018530406568     Document Type: Article

References (12)

1. W. P. RUNYAN, "Silicon Semiconductor Technology", (McGraw Hill, New York, 1985) p. 233.
2. S. DANYLUK and S. W. LEE, in "ASM Handbook", Vol. 18, "Friction, Lubrication and Wear Technology", edited by P. J. Blau (ASM International, Metals Park, Ohio, 1992) p. 685.
3. ASTM F394-74T "Tentative Test Method for Biaxial Flexure Strength (Modulus of Rupture) of Ceramic Substrates", (American Society for Testing and Materials, Philadelphia, PA, 1974).
4. C. P. CHEN and M. H. LEIPOLD, Am. Ceram. Soc. Ceram. Bull. 59 (1980) 469.
5. S. TIMOSHENKO and S. WOINOWSKY- KRIEGER, "Theory of Plates and Shells", 2nd Edn (McGraw-Hill, New York, 1959).
6. Z. NADAI, Z. Physik 23 (1922) 366.
7. W. A. BASSALI, Proc. Cambridge Philos. Soc. 53 (1957) 728.
8. J. J. WORTMAN and R. A. EVANS, J. Appl. Phys. 36(1) (1965) 153.
9. F. SHIMURA, "Semiconductor Silicon Crystal Technology" (Academic Press, San Diego, 1989).
10. W. WEIBULL, Acta Metall. 11 (1963) 725.
11. RICHARD W. HERTZBERG, "Deformation and Fracture Mechanics of Engineering Materials", 2nd Edn, (Wiley, New York, 1983).
12. C. P. CHEN and M. LIEPOLD, in "Proceedings of the 15th IEEE Photovoltaic Specialists Conference", Kissimee, 1981 (IEEE, New York) p. 1122.