Mechanisms of wafer sawing and impact on wafer properties

Progress in Photovoltaics: Research and Applications

Volumn 18, Issue 8, 2010, Pages 563-572

  Bidiville, A ^a,b   Wasmer, K ^a   Michler, J ^a   Nasch, P M ^c   Van Der Meer, M ^c   Ballif, C ^b  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b EPFL   (Switzerland)

^c Applied Materials Switzerland   (Switzerland)

Author keywords

Silicon; Wafer; Wire sawing

Indexed keywords

MEASURED PARAMETERS; ON-WAFER; SILICON SURFACES; WAFER; WAFER SAWING; WAFER SURFACE; WIRE-SAWING;

SAWING; SEMICONDUCTING SILICON COMPOUNDS; WIRE;

SILICON WAFERS;

EID: 78649572869     PISSN: 10627995     EISSN: 1099159X     Source Type: Journal    
DOI: 10.1002/pip.972     Document Type: Article

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