Application study of the benefits for using silicon-carbide versus silicon in power modules

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn , Issue , 2012, Pages 2499-2505

  Wood, Robert A ^a   Salem, Thomas E ^b  

^a U S ARMY RESEARCH LABORATORY   (United States)

^b UNITED STATES NAVAL ACADEMY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPLICATION STUDIES; COMPARISON STUDY; EXPERIMENTAL CHARACTERIZATION; FABRICATION PROCESS; HIGH-CURRENT; MOSFETS; POWER CIRCUIT; POWER COMPONENTS; POWER MODULE; SIC DEVICES; SIMULATION MODEL;

COMPUTER SIMULATION; DC POWER TRANSMISSION; EXHIBITIONS; POWER ELECTRONICS; SILICON CARBIDE;

SILICON;

EID: 84860186310     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2012.6166173     Document Type: Conference Paper

References (32)

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