Microstructure and bonding strength of diffusion welding of Mo/Cu joints with Ni interlayer

Materials and Design

Volumn 39, Issue , 2012, Pages 81-86

  Zhang, Jian ^a   Shen, Qiang ^a   Luo, Guoqiang ^a   Li, Meijuan ^a   Zhang, Lianmeng ^a  

^a WUHAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

D. Diffusion bonding; E. Mechanical; F. Microstructure

Indexed keywords

MICROSTRUCTURE; TENSILE STRENGTH;

BONDED JOINT; BONDING STRENGTH; BONDING TEMPERATURES; DIFFUSION WELDING; E. MECHANICAL; F. MICROSTRUCTURE; HOLDING TIME; MAXIMUM VALUES; NI INTERLAYERS; PROCESSING PARAMETERS; XRD;

DIFFUSION BONDING;

EID: 84859939271     PISSN: 02613069     EISSN: 18734197     Source Type: Journal    
DOI: 10.1016/j.matdes.2012.02.032     Document Type: Article

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