Interface microstructure and diffusion kinetics in diffusion bonded Mg/Al joint

Reaction Kinetics and Catalysis Letters

Volumn 95, Issue 1, 2008, Pages 71-79

  Wang, Juan ^a,b   Li, Yajiang ^a   Huang, Wanqun ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

^b SHANDONG UNIVERSITY   (China)

Author keywords

Diffusion bonding; Diffusion kinetics; Interface microstructure; Mg Al joint

Indexed keywords

ACTIVATION ENERGY; ALUMINUM; ATOMIC SPECTROSCOPY; DIFFUSION BONDING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY;

ATOM DIFFUSIONS; BASE METALS; BONDED JOINTS; DIFFUSION ACTIVATION ENERGIES; DIFFUSION KINETICS; ELECTRON PROBE MICROANALYSER; ENERGY DISPERSIONS; HEATING TEMPERATURES; HOLDING TIMES; IN DIFFUSIONS; INTERFACE MICROSTRUCTURE; INTERFACIAL TRANSITION ZONES; INTERMETALLIC LAYERS; MG/AL JOINT; SCANNING ELECTRON MICROSCOPES;

DIFFUSION;

EID: 57649177527     PISSN: 01331736     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11144-008-5259-9     Document Type: Article

References (11)

1. B.L. Mordike T. Ebert 2001 Mater. Sci. Engin. 302A 37
2. B.Y. Huang 2004 Chinese. J. Nonfer. Metal. 14 122
3. N. Kazuhiro 2001 J. Light Metal Weld. Constr. 39 26
4. T. Asahina H. Tokisue 2001 Mater. Trans. 42 2345
5. L.R. Wang C.H. Gung T.S. Shih 2001 J. Mater. Process. Technol. 116 101
6. P. Liu Y.J. Li J. Wang H.R. Geng 2004 Trans. China Weld. Inst. 25 5
7. G. Wagner 1969 Acta Metall. Mater. 17 99
8. G.N. Kryukova G.A. Zenkovets G. Mestl R. Schloql 2003 React. Kinet. Catat. Lett. 80 161
9. J.H. Huang: Diffusion in Metal and Alloys, p. 65. Metallurgical Industry Publisher, Beijing 1996.
10. D. Bradai M. Kadi 1999 J. Mater. Sci. 34 5331
11. Y. Du Y.A. Chang B.Y. Huang W.P. Gong 2003 Mater. Sci. Engin. 363A 140