Effects of diffusion induced recrystallization on volume diffusion in the copper-nickel system

Acta Materialia

Volumn 51, Issue 10, 2003, Pages 2765-2776

  Schwarz, S M ^a   Kempshall, B W ^a   Giannuzzi, L A ^a  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

Author keywords

Diffusion induced recrystallization (DIR); Diffusion of Ni into Cu; Volume diffusion

Indexed keywords

GRAIN BOUNDARIES; INTERDIFFUSION (SOLIDS); ION BEAMS; NICKEL; RECRYSTALLIZATION (METALLURGY);

DIFFUSION INDUCED RECRYSTALLIZATION (DIR);

COPPER;

EID: 0038188708     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(03)00082-X     Document Type: Article

References (38)

1. Hart E.W. Acta Metall. 5:1957;597.
2. Hassner A. Neue Hutte. 12:1967;161.
3. Krishtal M.A., Shcherbakov L.M., Mokrov A.P., Markova N.A. Fiz Metal Metalloved. 29:(2):1970;305.
4. Bernardini J., Cabane J. Acta Metallurgica. 21:1973;1571.
5. Aljeshin A.N., Prokofjev S.I. Poverkhnost, Fizika, Khimiya, Mechanika. 9:1986;131.
6. Renouf T.J. Phil Mag. 22:1970;359.
7. Ikushima A. J Phys Soc Japan. 14:1959;1636.
8. Levitskaya M.A., Gogel'son R.L. Izv Vuzou Chernaya metallurgiya. 3:1960;117.
9. Kawanami Y., Nakano M., Kajihara M., Mori T. Materials transactions. JIM. 39:(1):1998;218.
10. den Broeder F.J.A., Nakahara S. Scripta Metallurgica. 17:1983;399.
11. Mittemeijer E.J., Beers A.M. Thin Solid Films. 65:1980;125.
12. Liu D., Miller W.A., Aust K.T. Defect and Diffusion Forum. 66-69:1989;735.
13. Yamamoto Y., Kajihara M. Materials transactions. JIM. 42:(8):2001;1763.
14. Rhines F.N., Mehl R.F. Trans AIME. 128:1938;185.
15. Chen F.-S., King A.H. Scripta Metallurgica. 20:(10):1986;1401.
16. Chongmo L., Hillert M. Acta Metall. 30:1982;1133.
17. Schwarz S.M., Houge E.C., Giannuzzi L.A., King A.H. Journal of Crystal Growth. 222:(1-2):2001;392.
18. Boltzmann L. Wiedemann's Ann Phys. 53:1894;959.
19. Matano C. Japan Journal of Physics. 8:1933;109.
20. Giannuzzi LA, Drown JL, Brown SR, Irwin RB, Stevie FA. Specimen prepararion in materials for TEM analysis. IV Mater Res Soc 1997. p. 19-27.
21. Kamino T., Yaguchi T., Ohnishi T., Umemura K., Tomimatsu S. Microscopy and Microanalysis, Supplement 2 Proceedings. 6:2000;510.
22. Cliff G., Lorimer G.W. Journal of Microscopy. 103:(2):1975;203.
23. Williams D.B., Carter C.B. Transmission electron microscopy: A textbook for materials science. 1996;Plenum, New York.
24. Glicksman M.E. Diffusion in solids field theory, solid-state principles, and applications. 2000;John Wiley & Sons, Inc. New York.
25. Reed-Hill R.E., Abbaschian R. Physical metallurgy principles. 1994;PWS Publishing, Boston.
26. Monma K., Suto H., Oikawa H. Nippon Kinsoku Gakkaishi. 28:1964;192.
27. Helfmeier H., Feller-Kniepmeier M. Journal of Applied Physics. 41:1970;3202.
28. Taguchi O., Iijima Y., Hirano K. Journal of the Japan Institute of Metals. 48:1984;20.
29. Monma K., Suto H., Oikawa H. Nippon Kinsoku Gakkaishi. 28:1964;188.
30. Ikushima A. Journal of the Physical Society of Japan. 14:1959;1636.
31. Mackliet C.A. Physic Review. 109:1958;1964.
32. M.P. Macht, V. Naundorf, and R. Dohl, Proceedings of int conf on diffusion in metals and alloys at Tihany, Hungary, In: Kedves FJ, Beke DL, editors. Diffusion and Defect Monograph Series No. 7, Switzerland: Trans. Tech. Pub.; 1983. p. 516-518.
33. Monma K., Suto H., Oikawa H. Nippon Kinsoku Gakkaishi. 28:1964;192.
34. Kaur I., Mishin Y., Gust W. Fundamentals of grain and interphase boundary diffusion. 1995;Wiley, New York.
35. Kaja S, Ph. D. Thesis, The Pennsylvania State University, 1985.
36. den Broeder F.J.A. Scripta Metallurgica. 3:1969;321.
37. Kaur I., Mishin Y., Gust W. Fundamentals of grain and interphase boundary diffusion. 1995;Wiley, New York.
38. Chen F.-S., King A.H. Scripta Metallurgica. 21:1987;649.