Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al

Acta Materialia

Volumn 55, Issue 9, 2007, Pages 3169-3175

  Chen, Shangda ^a,b   Ke, Fujiu ^a,b   Zhou, Min ^c   Bai, Yilong ^b  

^a BEIHANG UNIVERSITY   (China)

^b INSTITUTE OF MECHANICS   (China)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Diffusion bonding; Molecular dynamics; Temperature effect; Tensile strength

Indexed keywords

DIFFUSION; DIFFUSION BONDING; MOLECULAR DYNAMICS; PLASTIC DEFORMATION; TENSILE STRENGTH; THERMAL EFFECTS;

BONDED SPECIMENS; BONDING PROCESS; INTERFACE THICKNESS;

SURFACE ROUGHNESS;

EID: 34247110543     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2006.12.040     Document Type: Article

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