Influences of diffusion bonding process parameters on bond characteristics of Mg-Cu dissimilar joints

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 20, Issue 6, 2010, Pages 997-1005

  Mahendran, G ^a   Balasubramanian, V ^b   Senthilvelan, T ^c  

^a VRS College of Engineering and Technology   (India)

^b ANNAMALAI UNIVERSITY   (India)

^c PONDICHERRY ENGINEERING COLLEGE   (India)

Author keywords

Bonding strength; Copper alloy; Diffusion bonding; Diffusion layer thickness; Interface hardness; Magnesium alloy; Shear strength

Indexed keywords

BOND CHARACTERISTICS; BONDING PRESSURE; BONDING STRENGTH; BONDING TEMPERATURES; BONDING TIME; CENTRAL COMPOSITE ROTATABLE DESIGN; DIFFUSION LAYER THICKNESS; DISSIMILAR JOINTS; EFFECT OF PARAMETERS; ELECTRICAL FORCE; FUSION WELDING; INTERFACE HARDNESS; JOINT INTERFACES; JOINT PERFORMANCE; MAXIMUM SHEARS; RESPONSE SURFACE METHODOLOGY; WORK ANALYSIS;

ALLOYS; COPPER; COPPER ALLOYS; DIFFUSION; DIFFUSION BONDING; DISSIMILAR METALS; MAGNESIUM; MAGNESIUM ALLOYS; SHEAR STRENGTH; SMELTING;

HARDNESS;

EID: 77955328676     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(09)60248-X     Document Type: Article

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