Diffusion bonding of 410 stainless steel to copper using a nickel interlayer

Materials Characterization

Volumn 61, Issue 6, 2010, Pages 626-634

  Sabetghadam, H ^a   Hanzaki, A Zarei ^a   Araee, A ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

Author keywords

Diffusion bonding; EPMA; Interlayer; Martensitic stainless steel; Shear strength

Indexed keywords

BONDED JOINT; CHEMICAL SYSTEMS; COMPRESSION LOADS; DIFFUSION TRANSITION; DIFFUSION ZONES; ELECTRON PROBE MICRO ANALYZER; ELEMENTAL ANALYSIS; ENERGY DISPERSIVE SPECTROMETRY; EPMA; INTERLAYER; MAXIMUM HARDNESS; MAXIMUM SHEARS; NICKEL INTERLAYER; PENETRATION PROFILES; PHASE CONSTITUTION; PROCESSING TEMPERATURE; REACTION LAYERS; TEMPERATURE RANGE;

BONDING; CHROMIUM; CORROSION RESISTANT ALLOYS; DIFFUSION; DIFFUSION BONDING; MARTENSITE; MARTENSITIC STAINLESS STEEL; NICKEL ALLOYS; OPTICAL MICROSCOPY; PHASE INTERFACES; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

STAINLESS STEEL;

EID: 77955231737     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchar.2010.03.006     Document Type: Article

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