Mechanism of forming interfacial intermetallic compounds at interface for solid state diffusion bonding of dissimilar materials

Materials Science and Engineering: A

Volumn 437, Issue 2, 2006, Pages 430-435

  He, P ^a   Liu, D ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Diffusion bonding; Diffusion flux; Intermetallic compounds

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; DISSIMILAR METALS; METAL FORMING; PHASE COMPOSITION; PHASE INTERFACES;

DIFFUSION BONDING; DIFFUSION FLUX; FLUX-ENERGY PRINCIPLE; MULTI-COMPONENT DIFFUSION COUPLE;

INTERMETALLICS;

BOND STRENGTH (MATERIALS); BONDING; DISSIMILAR METALS; INTERMETALLICS; METAL FORMING; PHASE COMPOSITION; PHASE INTERFACES;

EID: 33749531718     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.08.019     Document Type: Article

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