Solid state diffusion bonding of titanium to steel using a copper base alloy as interlayer

Journal of Materials Processing Technology

Volumn 209, Issue 5, 2009, Pages 2746-2752

  Elrefaey, A ^a   Tillmann, W ^a  

^a TU DORTMUND UNIVERSITY   (Germany)

Author keywords

Copper interlayer; Diffusion bonding; Microstructure; Steel; Titanium

Indexed keywords

BONDING; COPPER; DIFFUSION; DIFFUSION BONDING; DIFFUSION IN SOLIDS; DISSIMILAR METALS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; STEEL; TITANIUM; X RAY DIFFRACTION ANALYSIS;

ATOM DIFFUSIONS; BONDING PROCESS; COPPER INTERLAYER; COPPER-BASE ALLOYS; COPPER-BASED; HOLDING TIME; MICRO-HARDNESS MEASUREMENTS; PROCESSING PARAMETERS; SCANNING ELECTRONS; SEM; SHEAR STRENGTH TESTS; SOLID-STATE DIFFUSIONS; X-RAY DIFFRACTOMETRY;

TITANIUM ALLOYS;

EID: 59549106253     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2008.06.014     Document Type: Article

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