Kirkendall porosity during thermal treatment of Mo-Cu nanomultilayers

Materials Science and Engineering: A

Volumn 459, Issue 1-2, 2007, Pages 145-150

  Srinivasan, Dheepa ^a   Subramanian, P R ^b  

^a EPIP   (India)

^b GE GLOBAL RESEARCH   (United States)

Author keywords

Cu Mo; Kirkendall porosity; Nanomultilayers; Thermal grooving; Vacancy diffusion

Indexed keywords

GRAIN BOUNDARIES; HEAT TREATMENT; MAGNETRON SPUTTERING; MULTILAYERS; NANOSTRUCTURES; POROSITY; THERMODYNAMIC STABILITY;

KIRKENDALL POROSITY; NANOMULTILAYERS; THERMAL GROOVING; VACANCY DIFFUSION;

MOLYBDENUM ALLOYS;

GRAIN BOUNDARIES; HEAT TREATMENT; MAGNETRON SPUTTERING; MOLYBDENUM ALLOYS; MULTILAYERS; NANOSTRUCTURES; POROSITY; THERMODYNAMIC STABILITY;

EID: 34247232049     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.01.037     Document Type: Article

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