Effect of temperature on water molecules in a model epoxy molding compound: Molecular dynamics simulation approach

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 10, 2011, Pages 1533-1542

  Lee, Seung Geol ^a   Choi, Ji Il ^a   Koh, Wonsang ^b   Jang, Seung Soon ^a   Kim, Jongman ^c   Kim, Gene ^d  

^a Georgia Institute of Technology   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^d NONE   (United States)

Author keywords

Diffusion; epoxy; epoxy molding compound; molecular dynamics; packaging; simulation; water absorption

Indexed keywords

AMINE GROUPS; ATOMISTIC MOLECULAR DYNAMICS SIMULATIONS; CROSSLINKED; EFFECT OF TEMPERATURE; EPOXY; EPOXY MOLDING COMPOUNDS; HOPPING MECHANISM; HYDROXYL GROUPS; MOLECULAR DYNAMICS SIMULATIONS; SIMULATION; TOPOLOGICAL CONSTRAINTS; WATER DIFFUSION; WATER MOLECULE; WATER PHASE; WATER STRUCTURE; WATER TRANSPORT;

ACTIVATION ENERGY; DIFFUSION; DIFFUSION IN LIQUIDS; FUNCTIONAL GROUPS; MOLECULAR DYNAMICS; MOLECULAR MECHANICS; MOLECULES; PACKAGING; TEMPERATURE; WATER ABSORPTION; WATER CONTENT;

COMPUTER SIMULATION;

EID: 84859087543     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2011.2160343     Document Type: Article

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