Mechanism of adhesive finn popcorn in electronic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 487-493

  Zhao, Junfeng ^a   Yang, Cheng ^a   Huang, Zhenyu ^a   Wang, Michael ^a   Hu, Changmin ^a  

^a INTEL CORPORATION   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CRACK INITIATION; DELAMINATION; DIES; MOLDING; SILICON;

SUBSTRATE BASED PACKAGE; VOIDING;

ELECTRONICS PACKAGING;

EID: 35348832289     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373842     Document Type: Conference Paper

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3. Sawada, Y., Yamaguchi, A., Oka, S. and Fujioka, H., "Reliability of Plastic Ball Grid Array Package", IEEE Trans-CPT, Vol. 25, No. 1 (2002), pp, 73-77.
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