Experimental and numerical characterization of non-fickian moisture diffusion in electronic packages

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 3, 2009, Pages 666-674

  Celik, Emrah ^a   Guven, Ibrahim ^a   Madenci, Erdogan ^a  

^a University of Arizona   (United States)

Author keywords

Measurement; Modeling; Moisture; Simulation

Indexed keywords

ABSORPTION TESTS; ANSYS PLATFORM; DESORPTION TESTS; ELECTRONIC PACKAGE; ELECTRONIC PACKAGING MATERIAL; EXPERIMENTAL INVESTIGATIONS; EXPERIMENTAL MEASUREMENTS; FINITE ELEMENT SIMULATIONS; MODELING; MOISTURE ABSORPTION; MOISTURE CONCENTRATION; MOISTURE DESORPTION; MOISTURE DIFFUSION; MOISTURE WEIGHT; MULTI MATERIALS; NON-FICKIAN; NON-FICKIAN BEHAVIOR; NUMERICAL CHARACTERIZATION; ORGANIC SUBSTRATE; SIMULATION; TEMPERATURE AND RELATIVE HUMIDITY; TEST ENVIRONMENT; TEST MEASUREMENTS; UNDERFILL MATERIALS; UNDERFILLS;

ABSORPTION; ATMOSPHERIC HUMIDITY; CHIP SCALE PACKAGES; DESORPTION; ENVIRONMENTAL CHAMBERS; OVENS; PACKAGING MATERIALS; STOVES; TESTING;

MOISTURE;

EID: 68949181711     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2016848     Document Type: Article

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