A comparison of the theory of moisture diffusion in plastic encapsulated microelectronics with moisture sensor chip and weight-gain measurements

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 1, 2002, Pages 132-139

  Ardebili, Haleh ^a,b,c   Hillman, Craig ^b   Natishan, Marjorie Ann Erickson ^b,d   McCluskey, Patrick ^b   Pecht, Michael G ^b   Peterson, Dave ^e  

^a IEEE   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

^c GE GLOBAL RESEARCH   (United States)

^d Phoenix Engineering Associates Inc   (United States)

^e SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Capacitance change; Fickian diffusion modeling; Hydrogen bonding; Moisture diffusion; Moisture sensor; Plastic encapsulated microelectronics

Indexed keywords

PLASTIC ENCAPSULATED MICROELECTRONICS (PEM);

CHARACTERIZATION; CHIP SCALE PACKAGES; DEGRADATION; DIFFUSION; ENCAPSULATION; HIGH TEMPERATURE OPERATIONS; MOISTURE; PLASTIC MOLDS; SENSITIVITY ANALYSIS; SENSORS; SORPTION; SWELLING;

MICROELECTRONICS;

EID: 0036505164     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.991185     Document Type: Article

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