From leaded to lead free assembly and new packaging technology challenges

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1333-1339

  Lavoie, Helene ^a   Paquet, Marie Claude ^a   Sylvestre, Julien ^a   Ouimet, Sylvain ^a   Duchesne, Eric ^a   Barbeau, Stephane ^a   Gauvin, Marco ^a   Oberson, Valerie ^a  

^a IBM CANADA LTD   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD FREE ASSEMBLY; ORGANIC PACKAGING; RELIABILITY IMPACT; REPLACEMENT ALLOY; THERMOMECHANICAL BEHAVIOUR;

DEFECTS; DIELECTRIC MATERIALS; FINITE ELEMENT METHOD; LEAD COMPOUNDS; MELTING POINT; MICROELECTRONICS; TIN ALLOYS;

ELECTRONICS PACKAGING;

EID: 35348831655     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373968     Document Type: Conference Paper

References (3)

1. th ECTC, San Diego, CA, May 2006.
2. Sylvestre, J., "Integrated Modeling of C4 Interconnects", these proceedings (2007).
3. Wakharkar, V. et al., "Materials Technologies for Thermomechanical Management of Organic Packages" Intel Technology Journal, Vol. 09, Issue 04, 2005, pp. 60-74.