Deposition of nickel oxide by direct current reactive sputtering: Effect of oxygen partial pressure

Thin Solid Films

Volumn 520, Issue 9, 2012, Pages 3609-3613

  Karpinski, A ^a   Ferrec, A ^a   Richard Plouet, M ^a   Cattin, L ^a   Djouadi, M A ^a   Brohan, L ^a   Jouan, P Y ^a  

^a UNIVERSITÉ DE NANTES   (France)

Author keywords

Nickel oxide (NiO); Reactive sputtering and electrical discharge characteristics; Thin films; Transparent p type semiconductor

Indexed keywords

AS-DEPOSITED FILMS; CONDUCTIVE GLASS; CONSTANT DISCHARGE; CONTROLLED GROWTH; CRYSTALLOGRAPHIC DIRECTIONS; DEPOSITION CONDITIONS; DIRECT CURRENT; DIRECT-CURRENT MAGNETRONS; DISCHARGE CURRENTS; DISCHARGE VOLTAGES; EFFECT OF OXYGEN; NICKEL OXIDE THIN FILMS; NIO THIN FILM; OXYGEN CONTENT; POLYCRYSTALLINE; PREFERENTIAL GROWTH; TRANSPARENT P-TYPE SEMICONDUCTOR;

DEPOSITION; ELECTRIC DISCHARGES; MAGNETRONS; REACTIVE SPUTTERING; SEMICONDUCTOR GROWTH; SUBSTRATES; THIN FILMS; VAPOR DEPOSITION;

NICKEL OXIDE;

EID: 84857371437     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.12.068     Document Type: Article

References (28)

1. K.-C. Min, M. Kim, Y.-H. You, S.S. Lee, Y.K. Lee, T.-M. Chung, C.G. Kim, J.-H. Hwang, K.-S. An, N.-S. Lee, and Y. Kim Surf. Coat. Technol. 201 2007 9252
2. I. Porqueras, and E. Bertran Thin Solid Films 398-399 2001 41
3. Yi-Mu Lee, Cheng-Hsing Hsu, and Hung-Wei Chen Appl. Surf. Sci. 255 2009 4658
4. B. Sasi, and K.G. Gopchandran Sol. Energy Mater. Sol. Cells 91 2007 1505
5. B.A. Reguig, A. Khelil, L. Cattin, M. Morsli, and J.C. Bernede Appl. Surf. Sci. 253 2007 4330
6. I. Hotovy, J. Huran, J. Janik, and A.P. Kobzev Vacuum 51 1998 157
7. H. Sato, T. Minami, S. Takata, and T. Yamada Thin Solid Films 236 1993 27
8. M. Kitao, K. Izawa, K. Urabe, T. Komatsu, S. Kuwano, and S. Yamada Jpn. J. Appl. Phys. 33 1994 6656
9. B. Subramanian, M. Mohamed Ibrahim, V. Senthilkumar, K.R. Murali, V.S. Vidhya, C. Sanjeeviraja, and M. Jayachandran Physica B 403 2008 4104
10. Jiin-Long Yang, Yi-Sheng Lai, and J.S. Chen Thin Solid Films 488 2005 242
11. I. Hotovy, J. Huran, L. Spiess, S. Hascik, and V. Rehacek Sens. Actuators, B 57 1999 147
12. H.-L. Chen, Y.-M. Lu, and W.-S. Hwang Surf. Coat. Technol. 198 2005 138
13. V. Vancoppenolle, P.-Y. Jouan, M. Wautelet, J.-P. Dauchot, and M. Hecq J. Vac. Sci. Technol., A 17 1999 3317
14. V. Vancoppenolle, P.-Y. Jouan, A. Ricard, M. Wautelet, J.-P. Dauchot, and M. Hecq Appl. Surf. Sci. 205 2003 249
15. W.D. Sproul, D.J. Christie, and D.C. Carter Thin Solid Films 491 2005 1
16. D. Depla, S. Mahieu, and R. De Gryse Thin Solid Films 517 2009 2825
17. G. Mohan Rao, and S. Mohan J. Appl. Phys. 69 9 1991 6652
18. I. Safi Surf. Coat. Technol. 127 2000 203
19. S. Maniv, and W.D. Westwood J. Vac. Sci. Technol. 17 1980 743
20. A. Rizk, S.B. Youssef, and S.K. Habib Vacuum 38 1988 93
21. F. Guimaraes, J. Almeida, and J. Bretagne J. Vac. Sci. Technol., A 9 1 1991 133
22. J.W. McConkey, C.P. Malone, P.V. Johnson, C. Winstead, V. McKoy, and I. Kanik Phys. Rep. 466 2008 1
23. H. Liu, W. Zheng, X. Yan, and B. Feng J. Alloys Compd. 462 2008 356
24. L. Ai, G. Fang, L. Yuan, N. Liu, M. Wang, C. Li, Q. Zhang, J. Li, and X. Zhao Appl. Surf. Sci. 254 2008 2401
25. D.-J. Yun, and S.-W. Rhee J. Vac. Sci. Technol., B 26 5 2008 1787
26. J.-W. Park, J.-W. Park, D.-Y. Kim, and J.-K. Lee J. Vac. Sci. Technol., A 23 5 2005 1309
27. D.A. Wruck, M.A. Dixon, M. Rubin, and S.N. Bogy J. Vac. Sci. Technol., A 9 4 1991 2170
28. A. Karpinski, N. Ouldhamadouche, A. Ferrec, L. Cattin, M. Richard-Plouet, L. Brohan, M.A. Djouadi, and P.-Y. Jouan Thin Solid Films 519 2011 5767