An exergy-based figure-of-merit for electronic packages

Journal of Electronic Packaging

Volumn 128, Issue 4, 2006, Pages 360-369

  Shah, Amip J ^a   Carey, Van P ^a   Bash, Cullen E ^b   Patel, Chandrakant D ^b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b HEWLETT PACKARD LABORATORIES   (United States)

Author keywords

Chip package; Chip performance; Energy efficiency; Exergy; Second law analysis; Thermal management

Indexed keywords

ENERGY UTILIZATION; EXERGY; HEAT LOSSES; HEAT SINKS; MICROPROCESSOR CHIPS; RESOURCE ALLOCATION; THERMODYNAMIC PROPERTIES;

CHIP PACKAGES; CHIP PERFORMANCES; ENERGY COSTS; FIGURE-OF-MERIT (FOM); SECOND-LAW ANALYSIS;

CHIP SCALE PACKAGES;

EID: 33846677757     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2351901     Document Type: Article

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