Multiobjective optimal placement of convectively cooled electronic components on printed wiring boards

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 1, 1998, Pages 142-153

  Queipo, Nestor V ^b   Humphrey, Joseph A C ^c   Ortega, Alfonso ^a,d  

^a IEEE

^b UNIVERSIDAD DEL ZULIA   (Venezuela)

^c BUCKNELL UNIVERSITY   (United States)

^d University of Arizona   (United States)

Author keywords

Electronics cooling; Genetic algorithms; Multiobjective optimal placement; Printed wiring boards; Thermal management

Indexed keywords

COOLING; GENETIC ALGORITHMS; HEAT TRANSFER; MATHEMATICAL MODELS; NETWORK COMPONENTS; OPTIMIZATION; PRINTED CIRCUIT BOARDS;

MULTIATTRIBUTE UTILITY ANALYSIS; MULTIOBJECTIVE OPTIMAL PLACEMENT; THERMAL MANAGEMENT; THERMAL OVERHEATING;

INTEGRATED CIRCUIT LAYOUT;

EID: 0032022845     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.679044     Document Type: Article

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