Residual stress measurement in thin films at sub-micron scale using Focused Ion Beam milling and imaging

Thin Solid Films

Volumn 520, Issue 6, 2012, Pages 2073-2076

  Song, Xu ^a   Yeap, Kong Boon ^b   Zhu, Jing ^b   Belnoue, Jonathan ^a   Sebastiani, Marco ^c   Bemporad, Edoardo ^c   Zeng, Kaiyang ^b   Korsunsky, Alexander M ^a  

^a UNIVERSITY OF OXFORD   (United Kingdom)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^c ROMA TRE UNIVERSITY   (Italy)

Author keywords

Digital image correlation; Focused Ion Beam; Residual stress; Strain relief function

Indexed keywords

DIGITAL IMAGE CORRELATIONS; EXPERIMENTAL MEASUREMENTS; FINITE ELEMENT SIMULATIONS; FOCUSED ION BEAM MILLING; MATHEMATICAL DESCRIPTIONS; MILLING DEPTH; RING-CORE; STRAIN CHANGE; STRAIN RELIEF; STRESS EVALUATIONS; SUBMICRON SCALE;

FOCUSED ION BEAMS; FUNCTION EVALUATION; FUNCTIONS; IMAGE ANALYSIS; IONS; MILLING (MACHINING); RESIDUAL STRESSES; SINGLE CRYSTALS; STRAIN MEASUREMENT; THIN FILMS;

STRESS RELIEF;

EID: 84855933761     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.10.211     Document Type: Article

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