Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies

Acta Materialia

Volumn 56, Issue 5, 2008, Pages 977-984

  Yeap, Kong Boon ^a   Zeng, Kaiyang ^a   Chi, Dongzhi ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

Dielectrics; Interfaces; Nanoindentation; Thin films; Toughness

Indexed keywords

BUCKLING; DELAMINATION; DIELECTRIC MATERIALS; FILM THICKNESS; NANOINDENTATION; POTASSIUM; SILICON; THIN FILMS;

BUCKLING DELAMINATION; INTERFACIAL TOUGHNESS; WEDGE INDENTATION;

DIAMOND FILMS;

EID: 39149119327     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2007.10.051     Document Type: Article

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