Robust ultra-thin RuMo alloy film as a seedless Cu diffusion barrier

Journal of Alloys and Compounds

Volumn 516, Issue , 2012, Pages 102-106

  Hsu, Kuo Chung ^a   Perng, Dung Ching ^a   Wang, Yi Chun ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Cu diffusion barrier; Cu metallization; RuMo alloy

Indexed keywords

ALLOY FILM; AMORPHOUS-LIKE; BARRIER LAYERS; BARRIER PERFORMANCE; CU DIFFUSION BARRIER; CU METALLIZATION; CU-INTERCONNECTS; DEPTH PROFILE; NANO-CRYSTALLINE STRUCTURES; ORDERS OF MAGNITUDE; RU FILM; SHEET RESISTANCE VARIATION; SI LAYER; TEST STRUCTURE; ULTRA-THIN;

ALLOYS; AMORPHOUS FILMS; COPPER; DIFFRACTION PATTERNS; INTERFEROMETRY; METALLIC FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

DIFFUSION BARRIERS;

EID: 84855568018     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2011.11.144     Document Type: Article

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