Diffusion barrier performance of W/Ta-W-N double layers for Cu metallization

Microelectronic Engineering

Volumn 83, Issue 3, 2006, Pages 423-427

  Song, Shuangxi ^a   Liu, Yuzhang ^a   Li, Ming ^a   Mao, Dali ^a   Chang, Chengkang ^a   Ling, Huiqin ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Agglomeration; Cu metallization; Diffusion barrier; Sputtering

Indexed keywords

METALLIZING; SYSTEM STABILITY; TANTALUM ALLOYS;

CU METALLIZATION; DIFFUSION BARRIER; DOUBLE LAYERS;

DIFFUSION;

EID: 33244459834     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2005.11.005     Document Type: Article

References (14)

1. S.P. Murarka Mater. Sci. Eng. R 19 1997 87
2. D.H. Kim, S.L. Cho, K.B. Kim, J.W. Park, and J.J. Kim Appl. Phys. Lett. 69 1996 4182
3. S.P. Maraka, R.J. Gutmann, A.E. Kaloyeros, and W.A. Lanford Thin Solid Films 236 1993 257
4. D. Gupta Mater. Chem. Phys. 41 1995 199
5. C.S. Liu, and L.J. Chen J. Appl. Phys. 74 1993 5505
6. H.J. Lee, K.W. Kwon, C. Ryu, and R. Sinclair Acta Mater. 47 1999 3965
7. M.-A. Nicolet Thin Solid Films 52 1978 415
8. J.S. Reid, E. Kolawa, R.P. Ruiz, and M.-A. Nicolet Thin Solid Films 236 1993 319
9. J.S. Reid, X. Sun, E. Kolawa, and M.-A. Nicolt IEEE Electron. Dev. Lett. 15 8 1994 298
10. J.S. Reid, R.Y. Liu, P.M. Smith, R.P. Ruis, and M.-A. Nicolt Thin Solid Films 262 1995 218
11. Yuzhang Liu, Shuangxi Song, Dali Mao, Huiqin Ling, and Ming Li Microelectron. Eng. 75 2004 309
12. Ching-Yu Yang, J.S. Jeng, and J.S. Chen Thin Solid Films 420-421 2000 398
13. M. Uekubo, T. Oku, and K. Nii Thin Solid Films 286 1996 170
14. J. Baumann, M. Markert, T. Werner, A. Ehrlich, M. Rennau, Ch. Kaufmann, and T. Gessner Microelectron. Eng. 37/38 1997 229