The impact of substrate properties and thermal annealing on tantalum nitride thin films

Applied Surface Science

Volumn 258, Issue 7, 2012, Pages 2894-2900

  Grosser, M ^a   Munch M ^a   Seidel, H ^a   Bienert, C ^b   Roosen, A ^b   Schmid, U ^c  

^a SAARLAND UNIVERSITY   (Germany)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^c VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

LTCC; Microstructure; Resistivity; Tantalum nitride; Thermal annealing; Thin films magnetron sputtering

Indexed keywords

CERAMIC PRODUCTS; DEPOSITION; ELECTRIC CONDUCTIVITY; MICROSTRUCTURE; NITRIDES; NITROGEN; SUBSTRATES; SURFACE PROPERTIES; SURFACE ROUGHNESS; TANTALUM COMPOUNDS; TEMPERATURE; TOPOGRAPHY;

ELECTRICAL MEASUREMENT; ENVIRONMENTAL CONDITIONS; LOW TEMPERATURE CO-FIRED CERAMICS; LTCC; SURFACE CHARACTERISTICS; TANTALUM NITRIDES; TANTALUM NITRIDES (TANX); THERMAL-ANNEALING;

THIN FILMS;

EID: 84855519787     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2011.11.003     Document Type: Article

References (40)

1. M. Peikert, E. Wieser, H. Reuter, and C. Wenzel Vacuum 69 2003 91 95
2. L. Pereira, H. Águas, E. Fortunato, and R.R. Martins Appl. Surf. Sci. 253 2006 339 343
3. C. Christensen, R. de Reus, and S. Bouwstra J. Micromech. Microeng. 9 1999 113 118
4. K. Valleti, A. Subrahmanyam, S.V. Joshi, A.R. Phani, M. Passacantando, and S. Santucci J. Phys. D: Appl. Phys. 41 2008 45409
5. K. Hieber Thin Solid Films 24 1974 157 164
6. I. Ayerdi, E. Castano, A. Garcia-Alonso, and F.J. Gracia Sens. Actuators A 42 1994 435 438
7. I. Ayerdi, E. Castano, A. Garcia-Alonso, and F.J. Gracia Sens. Actuators, A 46-47 1995 218 221
8. I. Ayerdi, E. Castano, A. Garcia-Alonso, and F.J. Gracia Sens. Actuators, A 60 1997 72 75
9. Z.H. Meiksin, E.J. Stolinski, H.B. Kuo, R.A. Mirchandani, and K.J. Shah Thin Solid Films 12 1972 85 88
10. G.-S. Chung Sens. Actuators, A 135 2007 355 359
11. G.-S. Chung, K.-C. Lee, and J.-H. Lee J. Korean Phys. Soc. 49 2006 1379 1383
12. S. Fricke, A. Friedberger, G. Mueller, H. Seidel, and U. Schmid IEEE Sensors Conference Leece, 26-29.10. 2008 2008 1532 1535
13. Y.Y. Wu, A. Kohn, and M. Eizenberg Jpn. J. Appl. Phys. 95 2004 6167 6174
14. C.-T. Wei, and H.-P.P.D. Shieh Jpn. J. Appl. Phys. 45 2006 6405 6410
15. K. Baba, and R. Hatada Surf. Coat. Technol. 84 1996 429 433
16. K. Frisk J. Alloys Compd. 278 1998 216 226
17. C.-C. Chang, J.S. Jeng, and J.S. Chen Thin Solid Films 413 2002 46 51
18. K. Deok-kee, L. Heon, K. Donghwan, and K.K. Young J. Cryst. Growth 283 2005 404 408
19. A.O. Ibidunni Oxid. Met. 1993 5 20
20. R.S. Okojie, G.M. Beheim, G.J. Saad, and E. Savrun AIAA Space 2001 Conference and Exposition Albuquerque 2001
21. S. Fricke, A. Friedberger, H. Seidel, and U. Schmid Proc. Eng. 139 2010 6 1400
22. M.R. Gongora-Rubio, P. Espinoza-Vallejos, L. Sola-Laguna, and J.J. Santiago-Avilés Sens. Actuators, A 89 2001 222 241
23. M.A. Fonseca, J.M. English, M. von Arx, and M.G. Allen Int. Confer. Solid State Sens. Actuators 2001 486 489
24. M.A. Fonseca, J.M. English, M. von Arx, and M.G. Allen J. Microelectromech. Syst. 11 2002 337 343
25. C. Bienert, and A. Roosen J. Eur. Ceram. Soc. 30 2010 369-274
26. D.K. Schroder Semiconductor Material and Device Characterization 2nd ed. 1998 John Wiley & Sons, Inc., Wiley New York
27. D.K. Schroder Semiconductor Material and Device Characterization 1990 John Wiley & Sons, Inc., Wiley New York
28. F. James, and Shakelford The CRC Materials Science and Engineering Handbook 1992 CRC Press Boca Raton
29. V.P. Kolonits, M. Czermann, O. Geszti, and M. Menyhard Thin Solid Films 123 1985 45 55
30. M. Grosser, M. Münch, J. Brenner, M. Wilke, H. Seidel, C. Bienert, A. Roosen, and U. Schmid Microsyst. Technol. 16 2010 825 836
31. C.-S. Shin, Y.-W. Kim, D. Gall, J.E. Greene, and I. Petrov Thin Solid Films 402 2002 172 182
32. K. Radhakrishnan, N. Geok Ing, and R. Gopalakrishnan Mater. Sci. Eng., B 57 1999 224 227
33. U. Schmid, and H. Seidel Thin Solid Films 489 2005 310 319
34. J. Vicens, and P. Delavignette Phys. Status Solidi A 33 1976 497 509
35. X. Zhou, H. Dong, H. Li, and B. Liu Vacuum 39 1989 307 308
36. Q.Y. Zhang, B. Chen, G.B. Li, S. Jin, F.X. Chen, D.Z. Yang, and Y.C. Zhu Surf. Coat. Technol. 66 1994 468 471
37. J. Gatterer, G. Dufek, P. Ettmayer, and R. Kieffer Monatsh. Chem./Chem. Mon. 106 1975 1137 1147
38. C.A. Steidel, and D. Gerstenberg J. Appl. Phys. 40 1969 3828 3835
39. Y. Namba Jpn. J. Appl. Phys. 9 1970 1326 1329
40. D.P. Brady, F.N. Fuss, and D. Gerstenberg Thin Solid Films 66 1980 287 302