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Applied Physics Letters

Volumn 99, Issue 25, 2011, Pages

Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits

(4) Hsu, Hsueh Hsien a Huang, Shin Yi b Chang, Tao Chih b Wu, Albert T a

a NATIONAL CENTRAL UNIVERSITY (Taiwan)

b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

3-DIMENSIONAL; MICRO VOIDS; MICRO-BUMPS; SOLDER VOLUME; STRESS-INDUCED; THERMAL EXPANSION COEFFICIENTS;

CRACKS; FAILURE MODES; INTERMETALLICS; SOLDERING ALLOYS; THERMAL AGING;

THERMAL EXPANSION;

EID: 84555190845 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.3671391 Document Type: Article

Times cited : (16)

References (17)

1
- 4444275224
- 10.1143/JJAP.43.L829
- A. Klumpp, R. Merkel, P. Ramm, J. Weber, and R. Wieland, Jpn. J. Appl. Phys. 43 (7A), L829 (2004). 10.1143/JJAP.43.L829
- (2004) Jpn. J. Appl. Phys. , vol.43 , Issue.7 A , pp. 829
- Klumpp, A.¹ Merkel, R.² Ramm, P.³ Weber, J.⁴ Wieland, R.⁵

2
- 68949210321
- 10.1109/TADVP.2009.2015674
- R. Johannessen, M. M. V. Taklo, and M. Sunding, IEEE Trans. Adv. Packag. 32, 683 (2009). 10.1109/TADVP.2009.2015674
- (2009) IEEE Trans. Adv. Packag. , vol.32 , pp. 683
- Johannessen, R.¹ Taklo, M.M.V.² Sunding, M.³

3
- 0029223405
- S. Bader, W. Gust, and H. Hieber, Acta metall. Mater. 43, 329 (1995).
- (1995) Acta Metall. Mater. , vol.43 , pp. 329
- Bader, S.¹ Gust, W.² Hieber, H.³

4
- 54949136866
- 10.1007/s11664-008-0498-0
- H. Y. Son, G. J. Jung, B. J. Park, and K. W. Paik, J. Electron. Mater. 37, 1832 (2008). 10.1007/s11664-008-0498-0
- (2008) J. Electron. Mater. , vol.37 , pp. 1832
- Son, H.Y.¹ Jung, G.J.² Park, B.J.³ Paik, K.W.⁴

5
- 70349878952
- 10.1007/s11664-009-0922-0
- G. T. Lim, B. J. Kim, K. W. Lee, J. D. Kim, Y. C. Joo, and Y. B. Park, J. Electron. Mater. 38, 2228 (2009). 10.1007/s11664-009-0922-0
- (2009) J. Electron. Mater. , vol.38 , pp. 2228
- Lim, G.T.¹ Kim, B.J.² Lee, K.W.³ Kim, J.D.⁴ Joo, Y.C.⁵ Park, Y.B.⁶

6
- 78149406065
- B. J. Kim, G. T. Lim, J. D. Kim, K. W. Lee, Y. B. Park, H. Y. Lee, and Y. C. Joo, J. Electron. Mater. 39, 2281 (2010).
- (2010) J. Electron. Mater. , vol.39 , pp. 2281
- Kim, B.J.¹ Lim, G.T.² Kim, J.D.³ Lee, K.W.⁴ Park, Y.B.⁵ Lee, H.Y.⁶ Joo, Y.C.⁷

7
- 85057318185
- in (IEEE, Berlin)
- R. Labie, P. Limaye, K. W. Lee, C. J. Berry, E. Beyne, and I. D. Wolf, in Proceedings of 3rd Electronic System-Integration Technology Conference (IEEE, Berlin, 2010), pp. 1-5.
- (2010) Proceedings of 3rd Electronic System-Integration Technology Conference , pp. 1-5
- Labie, R.¹ Limaye, P.² Lee, K.W.³ Berry, C.J.⁴ Beyne, E.⁵ Wolf, I.D.⁶

8
- 2642517182
- 10.1016/j.actamat.2004.02.043
- N. S. Bosco and F. W. Zok, Acta Mater. 52, 2965 (2004). 10.1016/j.actamat.2004.02.043
- (2004) Acta Mater. , vol.52 , pp. 2965
- Bosco, N.S.¹ Zok, F.W.²

9
- 20344388336
- 10.1016/j.mser.2005.03.001
- T. Laurila, V. Vuorinen, and J. K. Kivilahti, Mater. Sci. Eng. R49, 1 (2005). 10.1016/j.mser.2005.03.001
- (2005) Mater. Sci. Eng. , vol.49 , pp. 1
- Laurila, T.¹ Vuorinen, V.² Kivilahti, J.K.³

10
- 0035248339
- 10.1109/6040.909621
- Y. C. Chan, P. L. Tu, C. W. Tang, K. C. Hung, and J. K. L. Lai, IEEE Trans. Adv. Packag. 24, 25 (2001). 10.1109/6040.909621
- (2001) IEEE Trans. Adv. Packag. , vol.24 , pp. 25
- Chan, Y.C.¹ Tu, P.L.² Tang, C.W.³ Hung, K.C.⁴ Lai, J.K.L.⁵

11
- 0742287497
- eds., (Van Nostrand Reinhold, New York)
- D. R. Frear, S. N. Burchett, H. S. Morgan, and J. H. Lau, eds., The Mechanics of Solder Alloy Interconnects (Van Nostrand Reinhold, New York, 1994) pp. 60.
- (1994) The Mechanics of Solder Alloy Interconnects , pp. 60
- Frear, D.R.¹ Burchett, S.N.² Morgan, H.S.³ Lau, J.H.⁴

12
- 58149102467
- (ESTC, Greenwich)
- T. Eckert, O. Bochow-Ness, A. Middendorf, K. Tetzner, and H. Reichl, Electronics System-Integration Technology Conference, 2008 (ESTC, Greenwich 2008), pp. 1035-1040.
- (2008) Electronics System-Integration Technology Conference, 2008 , pp. 1035-1040
- Eckert, T.¹ Bochow-Ness, O.² Middendorf, A.³ Tetzner, K.⁴ Reichl, H.⁵

13
- 78149413063
- 10.1007/s11664-010-1326-x
- T. Takahashi, S. Komatsu, H. Nishikawa, and T. Takemoto, J. Electron. Mater. 39, 2274 (2010). 10.1007/s11664-010-1326-x
- (2010) J. Electron. Mater. , vol.39 , pp. 2274
- Takahashi, T.¹ Komatsu, S.² Nishikawa, H.³ Takemoto, T.⁴

14
- 20344380936
- 10.1109/TEPM.2005.849685
- G. Galyon and L. Palimer, IEEE Trans. Electron. Packag. Manuf. 28, 17 (2005). 10.1109/TEPM.2005.849685
- (2005) IEEE Trans. Electron. Packag. Manuf. , vol.28 , pp. 17
- Galyon, G.¹ Palimer, L.²

15
- 77951611429
- 10.1063/1.3359658
- J. Cheng, S. Chen, P. T. Vianco, and J. C. M. Li, J. Appl. Phys. 107, 074902 (2010). 10.1063/1.3359658
- (2010) J. Appl. Phys. , vol.107 , pp. 074902
- Cheng, J.¹ Chen, S.² Vianco, P.T.³ Li, J.C.M.⁴

16
- 43049107171
- 10.1063/1.2912528
- E. Chason, N. Jadhav, L. Chan, L. Reinbold, and K. S. Kumar, Appl. Phys. Lett. 92, 171901 (2008). 10.1063/1.2912528
- (2008) Appl. Phys. Lett. , vol.92 , pp. 171901
- Chason, E.¹ Jadhav, N.² Chan, L.³ Reinbold, L.⁴ Kumar, K.S.⁵

17
- 33845684577
- 10.1007/s10854-007-9154-3
- K. N. Tu, C. Chen, and A. T. Wu, J. Mater. Sci.: Mater. Electron. 18, 269 (2007). 10.1007/s10854-007-9154-3
- (2007) J. Mater. Sci.: Mater. Electron. , vol.18 , pp. 269
- Tu, K.N.¹ Chen, C.² Wu, A.T.³

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