A study on the thermal reliability of Cu/SnAg double-bump flip-chip assemblies on organic substrates

Journal of Electronic Materials

Volumn 37, Issue 12, 2008, Pages 1832-1842

  Son, Ho Young ^a   Jung, Gi Jo ^b   Park, Byung Jin ^b   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b NEPES Corporation   (South Korea)

Author keywords

Cu SnAg double bumps; Fine pitch flip chip; Interfacial reactions; Reflow; Thermal aging; Thermal reliability

Indexed keywords

CU/SNAG DOUBLE-BUMPS; FINE-PITCH FLIP CHIP; INTERFACIAL REACTIONS; REFLOW; THERMAL RELIABILITY;

BRAZING; CHIP SCALE PACKAGES; CONTACT RESISTANCE; COPPER; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HEAT TREATMENT; INTERMETALLICS; MICROSCOPIC EXAMINATION; NICKEL ALLOYS; PHASE INTERFACES; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RELIABILITY; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; THERMAL AGING; THERMAL SPRAYING; WELDING;

TIN;

EID: 54949136866     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0498-0     Document Type: Article

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