High-temperature resistant intermetallic compound joints for Si chips and Cu substrates

Journal of Electronic Materials

Volumn 39, Issue 10, 2010, Pages 2274-2280

  Takahashi, Toshihide ^a   Komatsu, Shuichi ^a   Nishikawa, Hiroshi ^b   Takemoto, Tadashi ^b  

^a TOSHIBA CORPORATION   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

High temperature solder; High temperature storage test; Intermetallic compound; Lead free; Thermal cycling test

Indexed keywords

HIGH TEMPERATURE; HIGH-TEMPERATURE STORAGE; INTERMETALLIC COMPOUND; LEAD-FREE; THERMAL CYCLING TEST;

DIES; ELASTIC MODULI; JOINING; LEAD COMPOUNDS; NANOINDENTATION; POWER ELECTRONICS; SOLDERING ALLOYS; TESTING; THERMAL CYCLING; TIN;

INTERMETALLICS;

EID: 78149413063     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1326-x     Document Type: Article

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