SnAg microbumps for MEMS-based 3-D stacks

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 3, 2009, Pages 683-694

  Johannessen, Rolf ^a   Taklo, Maaike M Visser ^a   Sunding, Martin F ^b  

^a SINTEF   (Norway)

^b SINTEF MATERIALS AND CHEMISTRY   (Norway)

Author keywords

3 D integration; Electroplated SnAg solder; Fine pitch; Microbumps; Microelectromechanical systems (MEMS)

Indexed keywords

3-D INTEGRATION; ELECTROPLATED SNAG SOLDER; FINE PITCH; MICROBUMPS; MICROELECTROMECHANICAL SYSTEMS (MEMS);

BRAZING; COPPER; DIES; MECHATRONICS; MEMS; METALLIZING; MICROELECTROMECHANICAL DEVICES; NICKEL; NICKEL ALLOYS; REDUCTION; SEMICONDUCTING INTERMETALLICS; SILICON WAFERS; SILVER; SOLDERING ALLOYS; STRESSES; THERMAL CYCLING; THREE DIMENSIONAL; VISUAL COMMUNICATION; WELDING;

COMPOSITE MICROMECHANICS;

EID: 68949210321     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2009.2015674     Document Type: Article

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