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Volumn 12, Issue 2, 2012, Pages 396-400
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Parylene to silicon nitride bonding for post-integration of high pressure microfluidics to CMOS devices
a
EPFL
(Switzerland)
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Author keywords
[No Author keywords available]
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Indexed keywords
CARBON;
POLY(METHYL METHACRYLATE);
SILICON NITRIDE;
ARTICLE;
COST EFFECTIVENESS ANALYSIS;
DEVICE;
FLOW RATE;
HYPERBARISM;
LOW TEMPERATURE;
METHODOLOGY;
MICROFLUIDICS;
PRIORITY JOURNAL;
TECHNOLOGY;
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EID: 84055172801
PISSN: 14730197
EISSN: 14730189
Source Type: Journal
DOI: 10.1039/c1lc20727j Document Type: Article |
Times cited : (31)
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References (27)
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