Tensile strength of aluminium nitride films

Philosophical Magazine

Volumn 84, Issue 31, 2004, Pages 3353-3373

  Zong, Deng Gang ^a   Ong, Chung Wo ^a   Aravind, Manju ^a   Tsang, Mei P O ^a   Choy, Chung Loong ^a   Lu, Deren ^b   Ma, Dejun ^a  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; CHEMICAL VAPOR DEPOSITION; ELASTIC MODULI; FABRICATION; MICROELECTROMECHANICAL DEVICES; RESEARCH AND DEVELOPMENT MANAGEMENT; RESIDUAL STRESSES; ROBUSTNESS (CONTROL SYSTEMS); SEMICONDUCTING FILMS; STRAIN GAGES; TENSILE STRENGTH; TENSILE STRESS;

MICROBRIDGES; SILICON NITRIDE FILMS;

ALUMINUM NITRIDE;

EID: 8344259821     PISSN: 14786435     EISSN: None     Source Type: Journal    
DOI: 10.1080/14786430412331283604     Document Type: Article

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