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Volumn 66, Issue 3-4, 2002, Pages 441-446
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Effect of sputtering gas pressure and nitrogen concentration on crystal orientation and residual stress in sputtered AlN films
a
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Author keywords
Aluminum nitride film; Crystal orientation; Nitrogen concentration; Residual stress; Sputtering; Sputtering gas pressure
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Indexed keywords
ALUMINUM NITRIDE;
ARGON;
COMPRESSIVE STRESS;
CRYSTAL ORIENTATION;
GLASS;
MICROCRACKS;
NITROGEN;
PRESSURE EFFECTS;
RESIDUAL STRESSES;
SPUTTER DEPOSITION;
SUBSTRATES;
TENSILE STRESS;
X RAY DIFFRACTION ANALYSIS;
SPUTTERING GAS PRESSURES;
THIN FILMS;
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EID: 0037136161
PISSN: 0042207X
EISSN: None
Source Type: Journal
DOI: 10.1016/S0042-207X(02)00168-9 Document Type: Article |
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Times cited : (51)
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References (21)
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